Publications

Find below the links to each of the subsections:

Referred Journals
Referred Conference Proceedings
Book & Book Chapters
Selected Invited Talks

For further information, please contact the respective authors as listed below.

REFERRED JOURNALS

  1. N. L. K. Nguyen, B. Nguyen, T. Omori, D. P. Nguyen, R. Moroney, S. D’Agostino, W. Kennan, and A. Pham, “A Wideband SiGe Power Amplifier Using Modified Triple Stacked-HBT Cell”, IEEE Microwave Wireless Components Letters, pp. 1-4, early access, DOI: 10.1109/LMWC.2020.3040352, January 2021.
  2. D. P. Nguyen, X. Tran, A. Pham, “A Wideband High Dynamic Range Triple-stacked FET Dual Shunt Distributed Analog Voltage Controlled Attenuator”, accepted for publications in IET Microwaves, Antennas & Propagation, December 2020.
  3. S. Wagner, B. Worthmann, and A. Pham, “Minimizing Timing Jitter’s Impact on Ground-Penetrating Radar Array Coupling Signals,” IEEE Transactions on Geoscience and Remote Sensing, pp. 1-8, early access, DOI: 10.1109/TGRS.2020.3019976.
  4. N. L.K. Nguyen, N. Killeen, D. P. Nguyen, A. N. Stameroff, and A. Pham, “A Wideband Gain Enhancement Technique for Distributed Amplifiers,” IEEE Transactions on Microwave Theory and Techniques, Vol. 68, Issue 9, pp. 3697 – 3708, 2020.
  5. V. Camarchia, R. Quaglia, A. Piacibello, D. P Nguyen, H. Wang, and A. Pham, “A Review of Technologies and Design Techniques of Millimeter-Wave Power Amplifiers,” IEEE Transactions on Microwave Theory and Techniques, Vol. 68, Issue 7 Part 2, pp. 2957 – 2983, 2020.
  6. D. Nguyen, N. L.K. Nguyen, A. Stameroff, V. Camarchia, M. Pirola, and A. Pham, “A Wideband Highly Linear Distributed Amplifier Using Intermodulation Cancellation Technique for Stacked-HBT Cell,” IEEE Transactions on Microwave Theory and Techniques, Vol. 68, Issue 7 Part 2, pp. 2984 – 2997, 2020.
  7. N. L.K. Nguyen, D. Nguyen, A. Stameroff, and A. Pham, “A 1-160 GHz InP Distributed Amplifier Using 3-D Interdigital Capacitors,” IEEE Microwave Wireless Components Letters, Vol. 30, Issue 5, pp. 492-495, 2020.
  8. S. Wagner and A. Pham, “The Ultrawideband Elliptical Resistively-Loaded Vee Dipole,” IEEE Transactions on Antennas and Propagation, Vol. 68, Issue 4, pp. 2523-2530, 2019.
  9. M. S. Clements, A. Pham, J. S. Sacks, and S. E. Avery, “Second-Harmonic Injection Linearization of Millimeter-Wave FET Resistive Mixers,” IEEE Microwave Wireless Components Letters, Vol. 29, Issue 10, pp. 669-672, 2019.
  10. Chi Pham and A. Pham, “Novel Stacked-Defected Ground Structures for Ultra-Wideband Low Loss Balun Designs,” Microwave and Optical Technology Letters, Vol. 61, Issue 8, pp. 2008-2012, 2019.
  11. Thuy T Nguyen, Kohei Fujii, A. Pham, “A 4-20 GHz, Multi-Watt Level, Fully-Integrated Push-Pull Distributed Power Amplifier with Wideband Even-Order Harmonic Suppression,” IET Microwaves, Antennas & Propagation, Vol. 13, Issue 13, pp. 2279-2283, 2019.
  12. Duy P Nguyen, Binh L Pham, A. Pham, “A Compact Ka-Band Integrated Doherty Amplifier With Reconfigurable Input Network,” IEEE Transactions on Microwave Theory and Techniques, Vol. 67, Issue 1, pp. 205-215, January 2019.
  13. J-H Yu, Y-T Chang, K-Y Lin, C-C Chang, S-F Chang, Y Ye, A. Pham, B. Tobias, Y. Zhu, C. Domier, N. C. Luhmann Jr, “Millimeter-wave system-on-chip advancement for fusion plasma diagnostics,” Review of Scientific Instruments, Vol. 89, Issue 10, pp. 10H108, October 2018.
  14. J-H Yu, Y-T Chang, K-Y Lin, C-C Chang, S-F Chang, Y Ye, A. Pham, B. Tobias, Y. Zhu, C. Domier, N. C. Luhmann Jr, “Liquid crystal polymer receiver modules for electron cyclotron emission imaging on the DIII-D tokamak,” Review of Scientific Instruments, Vol. 89, Issue 10, pp. 10H120, October 2018.
  15. Duy P Nguyen, Thanh Pham, A. Pham, “A 28-GHz Symmetrical Doherty Power Amplifier Using Stacked-FET Cells,” IEEE Transactions on Microwave Theory and Techniques, Vol. 66, Issue 6, pp. 2628-2637, June 2018.
  16. Chi Van Pham, A. Pham, Robert E Leoni, “Design of 600-W Low-Loss Ultra-Wideband Ferriteless Balun,” IEEE Transactions on Microwave Theory and Techniques, Vol. 66, Issue 2, pp. 902-910, February 2018.
  17. Duy P Nguyen, Jeffery Curtis, A. Pham, “A Doherty amplifier with modified load modulation scheme based on load–pull data,” IEEE Transactions on Microwave Theory and Techniques, Vol. 66, Issue 1, pp. 227-236, January 2018.
  18. Thuy T Nguyen, Kohei Fujii, A. Pham, “Highly Linear Distributed Mixer in 0.25- Enhancement-Mode GaAs pHEMT Technology,” IEEE Microwave and Wireless Components Letter, Vol. 27, Issue 12, pp. 116-118, December 2017.
  19. Duy P Nguyen, Binh L Pham, A. Pham, “A 1.5–45-GHz High-Power 2-D Distributed Voltage-Controlled Attenuator,” IEEE Transactions on Microwave Theory and Techniques, Vol. 65, Issue 11, pp. 4208-4217, November 2017.
  20. Y. Wang, B. Tobias, Y.-T. Chang, J.-H. Yu, M. Li, F. Hu, M. Chen, M. Mamidanna, T. Phan, A.-V. Pham, J. Gu, X. Liu, Y. Zhu, C.W. Domier, L. Shi, E. Valeo, G. J. Kramer, D. Kuwahara, Y. Nagayama, A. Mase, and N.C. Luhmann Jr, “Millimeter-wave imaging of magnetic fusion plasmas: technology innovations advancing physics understanding,” Nuclear Fusion, vol. 57, pp. 1-19, March 2017.
  21. T. Nguyen, A. Riddle, K. Fujii, A. Pham, “Development of wideband and high IIP3 millimeter-wave mixers,” IEEE Transactions on Microwave Theory and Techniques, Issue 99, March 2017.
  22. M. Darwish and A. Pham, “Development of a Parallel-FET Linearization Technique for High Efficiency GaN Power Amplifiers,” IEEE Microwave and Wireless Components Letter, vol.27, no.2, pp.1-3, Feb. 2017.
  23. B. Tobias, C. W. Domier, N. C. Luhmann Jr., C. Luo, M. Mamidanna, T. Phan, A.-V. Pham and Y. Wang. “Low-noise Heterodyne Receiver for Electron Cyclotron Emission Imaging and Microwave Imaging Reflectometry,” AIP Review of Scientific Instruments, 87, pp. 11E103-1- 11E103-3, 2016.
  24. Duy P. Nguyen, Anh-Vu Pham and Farshid Aryanfar, “A K-Band High Power and High Isolation Stacked-FET Single Pole Double Throw MMIC Switch Using Resonating Capacitor,” IEEE Microwave and Wireless Components Letter, Vol. 26, No. 9, pp. 696-699, September 2016.
  25. J. Curtis, A. Pham and F. Aryanfar, “Ka-band Doherty Power Amplifier with 26.9 dBm Output Power, 42% PAE and 32% back-off PAE Using GaAs pHEMT’s,” IET Journal of Microwaves, Antennas & Propagation, Vol. 10, Issue 10, pp. 1101-1105, 2016
  26. D. P. Nguyen and Anh-Vu Pham, “An Ultra Compact Watt-Level Ka-band Stacked-FET Power Amplifier,” IEEE Microwave and Wireless Components Letters, Vol. 26, Issue 7, pp. 516-518, 2016
  27. B. L. Pham, H. Ta, A. Pham, R. Leoni, and Y. Leviatan, “23:1 Bandwidth Ratio Quasi-Lumped Component Balun on a Multilayer Organic Substrate,” IET Journal of Microwaves, Antennas & Propagation, Vol. 10, Issue 5, pp. 561-567, 2016
  28. J. Jeon, J. Chang; A. V. Pham, “Characterization, Analysis and Implementation of Integrated Bandstop Structures On Ultra-wide Band Archimedean Spiral Antenna,” IEEE Transactions on Antennas and Propagation, Vol. 65, No. 5, pp. 1999-2004, May 2016.
  29. H. Ta and A.-V. Pham “Compact Wide Stopband Band-pass Filter on Multilayer Organic Substrate” IEEE Microwave and Wireless Components Letters, pp. 161-163, Vol. 24, Issue 3, 2014.
  30. J. C. Chieh, B. Pham, A.-V. Pham, G. Kannell, and A. Pidwerbetsky, “Millimeter-wave Dual Polarized High Isolation Antennas and Arrays on Organic Substrates,” IEEE Transactions on Antennas and Propagation, Vol. 61, Issue 12, pp. 5948-5957, 2013
  31. A. N. Stameroff, H. Ta, A. Pham, and R. E. Leoni, “Wide bandwidth power-combining and inverse class-F GaN power amplifier at X-band,” IEEE Transactions on Microwave Theory and Techniques, Vol. 61, Issue 3, pp. 1291-1300, 2013.
  32. J. C. Chieh and A.-V. Pham, “A Bidirectional Microstrip X-Band Antenna Array on Liquid Crystal Polymer for Beamforming Applications,” IEEE Transactions on Antennas and Propagation, Vol. 61, Issue 6, pp. 3364-3368, 2013.
  33. H. Ta and A.-V Pham, “Dual Band Band-Pass Filter With Wide Stopband on Multilayer Organic Substrate” IEEE Microwave and Wireless Components Letters, Vol. 23, Issue 4, pp. 193-195, 2013.
  34. J. C. Chieh, A.-V Pham, A. Pidwerbetsky, and G. Kannell “A Low Cost 8 × 8 W-Band Substrate Integrated Waveguide Antenna Array Detector on LCP,” Microwave and Optical Technology Letters, Vol. 55, No. 8, pp. 1825-1830, 2013.
  35. H. Ta and A.-V. Pham, “A Compact Broadband Balun on Multilayer Organic Substrate,” Microwave and Optical Technology Letters, Vol. 55, No. 8, pp. 1957-1959, 2013.
  36. H. Ta, B. L. Pham, and A.-V. Pham, “Compact Wide Bandwidth Balun Based on Modified Asymmetric Broadside Coupled Lines,” IEEE Microwave and Wireless Components Letters, Vol. 22 , Issue 12, pp. 624-626, 2012.
  37. K. Aihara, M. J. Chen, C. Chen, and A. Pham, “Reliability of Liquid Crystal Polymer air cavity packaging,” IEEE Transaction on Components, Packaging, and Manufacturing Technology, Vol. 2, No. 2, pp. 224-230, 2012.
  38. A. Pham, “Packaging with Liquid Crystal Polymer,” IEEE Microwave Magazine, Vol. 12, Issue 5, pp. 83-91, 2011.
  39. Jia-Chi S. Chieh and A. Pham, “Development of a wide bandwidth Wilkinson power divider on multilayer organic substrates,” Microwave and Optical Technology Letters, Vol. 52, Issue 7, pp. 1606-1609, 2010.
  40. H. Ta and A. Pham, “Development of a compact broadband folded hybrid coupler on multilayer organic substrate,” IEEE Microwave and Wireless Components Letters, Vol. 20, Issue 2, pp. 76-78, 2010.
  41. C. A. Chen, A. Pham, and R. E Leoni, “A novel broadband even-mode matching network for Marchand baluns,” IEEE Transactions on Microwave Theory and Techniques, Vol. 57, Issue 12, pp. 2973-2980, 2009.
  42. K. Aihara, Z. Zhang, A-V. Pham, D. Zeeb, T. Flack and E. Stoneham, “Development of multilayer Liquid Crystal Polymer Ka-band downconverter modules,” Microwave and Optical Technology Letters, Vol. 51, No. 2, pp. 364-367, 2009.
  43. M. J. Chen, Z. Zhang, A-V. H. Pham and D. Hyman, “Design and development of a broadband amplitude compensated long time delay circuit on thin-film Liquid Crystal Polymer,” Microwave and Optical Technology Letters, Vol. 51, No. 4, pp. 1060-1063, 2009.
  44. K. Aihara, M. J. Chen, and A. Pham, “Development of thin-film Liquid Crystal Polymer surface mount packages for Ka-band applications,” IEEE Transactions on Microwave Theory and Techniques, Vol. 56, Issue 9, pp. 2111-2117, 2008.
  45. S.-W Seo, J. Yan, J.-H Baek, F. M. Soares, R. Broeke, A.-V. Pham, and S. J. B. Yoo, “Microwave velocity and impedance tuning of traveling-wave modulator using ion implantation for monolithic integrated photonic systems,” Microwave and Optical Technology Letters, Vol. 50, No. 8, pp. 2151-2155, 2008.
  46. M. McGrath and A.-V. H. Pham, “Microwave based ammonia detection with vertically aligned carbon nanotube arrays,” ASP Sensor Letters, Vol. 6, pp. 719-722, 2008.
  47. M. J. Chen, A. Pham, N. A. Evers, C. Kapusta, J. Iannotti, W. Kornrumpf, J. Maciel, N. Karabudak, “Multilayer organic multi-chip module implementing hybrid microelectromechanical systems,” IEEE Transactions on Microwave Theory and Techniques, Vol. 56, No. 4, pp. 952-958, April 2008.
  48. C. Lu, A. Pham, M. Shaw, and C. Saint, “Linearization of CMOS broadband power amplifiers through combined multigated transistors and capacitance compensation,” IEEE Transactions on Microwave Theory and Techniques, Vol. 55, pp. 2320-2328, November, 2007.
  49. A. C. Chen, M. J. Chen and A. Pham, “Design and Fabrication of Ultra-Wideband Baluns Embedded in Multilayer Liquid Crystal Polymer Flex,” IEEE Transactions on Advanced Packaging, Vol. 30, No. 3, pp. 533-540, August 2007.
  50. R. G. Broeke, J. Cao, C. Ji, Sang-Woo Seo, Y. Du, N. K. Fontaine, Jong-Hwa Baek, John Yan, F. M. Soares, F. Olsson, S. Lourdudoss, A. V. Pham, M. Shearn, A. Scherer, S. J. B. Yoo, “Optical-CDMA in InP,” IEEE Journal of IEEE Journal of Selected Topics in Quantum Mechanics, Vol. 13, No. 5, pp. 1497-1507, Sept. 2007.
  51. S. J. B. Yoo, J. P. Heritage, V. Hernandez, R. Scott, W. Cong, N. Fontaine, R. Broeke, J. Cao, S.-W. Seo, J.-H. Baek, F. Soares, Y. Du, C. Yang, W. Jiang, K. Aihara, Z. Ding, B. Kolner, A.-V Pham, S. Lin, F. Olsson, Y. Sun, S. Lourdudoss, K.Y. Liou, S.N.G. Chu, R. Hamm, B. Patel, W.S. Hobson, J. R. Lothian, S. Vatanapradit, L. Gruezke, W. T. Tsang, M. Shearn, and A. Scherer “Spectral phase encoded time spread (SPECTS) optical code division multiplex access technology for next generation communication networks,” OSA Journal of Optical Networks, Vol. 6, Issue 10, pp. 1210-1227, April 2007.
  52. A. Keerti and A.-V Pham, “RF characterization of SiGe HBT power amplifiers under load mismatch,” IEEE Transactions on Microwave Theory and Techniques, Vol. 55, Issue 2, pp. 207–214, February 2007.
  53. J. Cao, R. G. Broeke, N. K. Fontaine, C. Ji, Y. Du, N. Chubun, K. Aihara, A.-V. Pham, F. Olsson, S. Lourdudoss, S. J. B. Yoo, “Demonstration of spectral phase O-CDMA encoding and decoding in monolithically integrated arrayed-waveguide-grating-based encoder,” IEEE Photonics Technology Letters, Vol. 18, Issue 24, pp. 2602-2604, Dec. 15, 2006.
  54. M. Mcgrath and A. Pham, “Carbon nanotube based microwave resonator gas sensors,” International Journal of High Speed Electronics and Systems, vol. 16, no. 4, pp. 913-935, December 2006. (Invited)
  55. M. J. Chen, A. Pham, N. A. Evers, C. Kapusta, J. Iannotti, W. Kornrumpf, J. Maciel, N. Karabudak, “Design and Development of a package using LCP for RF/Microwave MEMS switches,” IEEE Transaction on Microwave Theory and Techniques, Vol. 54, Issue 11, pp.4009-4015, Nov. 2006.
  56. Chao Lu, A. Pham, and Darrell Livezey, “On the feasibility of CMOS multi-band phase shifters for multiple-antenna transmitters,” IEEE Microwave and Wireless Components Letters, Vol. 16, pp. 255 – 257, Issue 5, May 2006.
  57. A. Keerti, J. Xiang, and A. Pham, “High power linearized RF phase shifter using anti-series diodes,” IEEE Microwave and Wireless Components Letters, Vol. 16, Issue 4, pp. 200 – 202, April 2006.
  58. C. Lu, A. Pham, and Darrell Livezey, “Development of multi-band phase shifters in 180 nm RF CMOS technology with active loss compensation,” IEEE Transactions on Microwave Theory and Tech., Vol. 54, Issue 1, pp. 40 – 45, Jan. 2006.
  59. A. C. Chen, A. Pham, and R. E. Leoni, III, “Development of low-loss, broadband planar baluns using multilayered organic thin-films,” IEEE Transactions on Microwave Theory and Techniques, Vol. 53, Issue11, pp. 3648-3655, Nov. 2005.
  60. S. Chopra, K. McGuire, N. Gothard, A. M. Rao, and A. Pham, “Selective gas detection using a carbon nanotube sensor,” Applied Physics Letters, vol. 38, no. 11, pp. 2280 – 2282, September 2003.
  61. A. Keerti and A. Pham, “SiGe power devices for 802.11a wireless LAN applications at 5 GHz,” IEE Electronics Letters, vol. 39, no. 16, pp. 1218-1220, August 2003.
  62. S. Chopra, K. McGuire, N. Gothard, A.M. Rao, and A. Pham, “Selective gas detection using a carbon nanotube sensor,” Applied Physics Letters, vol. 38, no. 11, September 2003.
  63. S. Manohar, A. Pham, J. Brown, R. Borges, and K. Linthicum, “Microwave GaN-based power transistors on large-scale silicon wafers,” International Journal of High Speed Electronics and Systems, vol. 13, no. 1, pp. 265-275, 2003 (Invited)
  64. S. Manohar, A. Pham, and N. Evers “Direct determination of the bias-dependent series parasitic elements in SiC MESFETs,” IEEE Transactions on Microwave Theory and Techniques, vol. 51, pp. 597-600, Feb. 2003.
  65. D. Newlin, A. Pham, and J. Harriss, “Development of low loss organic-micromachined interconnects on silicon at microwave frequencies,” IEEE Transactions on Components and Packaging Technologies, vol. 25, pp. 506-510, September 2002.
  66. S. Chopra, A. Pham, J. Gaillard, A. Parker, and A. M. Rao, “Carbon-nanotube-based resonant-circuit sensor for ammonia,” Applied Physics Letters, vol. 80, no. 24, p. 4632, June 2002.
  67. R. Ramachandran and A. Pham, “Development of RF/Microwave on-chip inductors using an organic micromachining process,” IEEE Transactions on Advanced Packaging, vol. 25, pp. 244-247, May 2002.
  68. A. Pham, V. Krishnamurthy, D. Bates, W. Marcinkewicz, B. Schmanski, P. Piacente, and L. Sprinceanu, “Development of integral passive components for multilayer organic MCMs at millimeter wave frequencies,” IEEE Transaction on Advanced Packaging, vol. 25, pp. 98-101, Feb. 2002.
  69. A. Pham, R. Ramachandran, J. Laskar, V. Krishnamurthy, D. Bates, W. Marcinkewicz, B. Schmanski, P. Piacente, and L. Sprinceanu, “Development of a millimeter wave system on a package utilizing an MCM process,” IEEE Transactions on Microwave Theory and Techniques, pp. 1747-1749, Oct. 2001.
  70. A. Pham, A. Sutono, J. Laskar, V. Krishnamurthy, D. Lester, E. Balch, and J. Rose, “Development of microwave multilayer plastic-based multichip modules,” IEEE Transactions on Advanced Packaging, pp. 37-40, Feb. 2001.
  71. A. Sutono, A. Pham, J. Laskar, and W. R. Smith, “RF/microwave characterization of multilayer ceramic-based MCM technology” IEEE Transactions on Advanced Packaging, pp. 326-331, August 1999.
  72. A. Pham, J. Laskar, V. Krishnamurthy, H. Cole, and T. Sitnik-Nieters, “Ultra low loss millimeter wave multichip module interconnects,” IEEE Transactions on Component Packaging Manufacturing Technologies, vol. 21, pp. 302-308, August 1998.
  73. C. Chun, A. Pham, B. Hutchison, and J. Laskar “Development of microwave package models utilizing on-wafer measurement techniques,” IEEE Transactions Microwave Theory Techniques, pp.1948-1954, October 1997.

REFERRED CONFERENCE PROCEEDINGS

  1. S. Wagner and A. Pham, “Standoff non-Line-of-sight vibration sensing using millimeter-wave radar,” to be presented at IEEE European Radar Conference (EuRAD), Jaarbeurs Utrecht, The Netherlands, 2020/2021.
  2. N. L.K. Nguyen, D. P. Nguyen, A. N. Stameroff, and A. Pham, “A High Output Power 1 – 150 GHz Distributed Power Amplifier in InP HBT Technology,” Proceedings of IEEE Asia-Pacific Microwave Conference (APMC), Hong-Kong, November 2020 (Best paper award in Microwaves).
  3. A. Iba, C. W. Domier, M. Ikeda, A. Mase, A. Pham, and N. C. Luhmann, “Realizing sub-diffraction focusing for terahertz,” Proceedings of IEEE 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), Paris, France, 2019.
  4. S. Wagner and A. Pham, “Structural effect on image quality degradation in ground-penetrating radar array,” Proceedings of IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, Atlanta, GA, 2019.
  5. D. P. Nguyen, X. T. Tran, N. L. K. Nguyen, P. T. Nguyen, and A. Pham, “A Wideband high efficiency Ka-Band MMIC power amplifier for 5G wireless communications,” Proceedings of IEEE International Symposium on Circuits and Systems (ISCAS), Hokkaido, Japan, 2019.
  6. S. Wagner, G. Le and A. Pham, “Ultrawideband compact 50:200 Ohm Guanella balun using asymmetric broadside-coupled lines,” Proceedings of IEEE Asia-Pacific Microwave Conference (APMC), pp. 485-487, Kyoto, Japan, 2018.
  7. G. Le, S. Wagner, C. Pham, J. S. Gomez-Diaz and A. Pham, “Inverted-F antenna radiation efficiency enhancement based on a slotted ground,” Proceedings of IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, pp. 307-308, Boston, MA, 2018.
  8. S. Wagner, A. Pham, S. Bond and J. Jeon, “Design of a wideband resistively loaded vee dipole fed by an even-mode matched Marchand balun,” Proceedings of IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, pp. 1353-1354, Boston, MA, 2018.
  9. C. V. Pham, T. A. Vu, W. Tran, A. Pham and C. S. Gardner, “Wireless energy harvesting system through metal for aerospace sensor,” Proceedings of IEEE Transportation Electrification Conference and Expo (ITEC), pp. 545-549, Long Beach, CA, 2018.
  10. D. P. Nguyen, N. L. K. Nguyen, A. N. Stameroff and A. Pham, “A highly linear InP distributed amplifier using ultra-wideband intermodulation feedforward linearization,”  Proceedings of IEEE International Microwave Symposium, pp. 1356-1359, Philadelphia, PA, 2018.
  11. M. S. Clements, A. Pham, J. S. Sacks, B. C. Henderson and S. E. Avery, “Comparison of highly linear resistive mixers in depletion and enhancement mode GaAs and GaN pHEMTs at Ka-Band,” Proceedings of IEEE International Microwave Symposium, pp. 435-438, Philadelphia, PA, 2018.
  12. N. S. Killeen, D. P. Nguyen, A. N. Stameroff, A. Pham and P. J. Hurst, “Design of a wideband bandpass stacked HBT distributed mmplifier in InP,” Proceedings of IEEE International Symposium on Circuits and Systems (ISCAS), pp. 1-5, Florence, Italy, 2018.
  13. C. Van Pham, B. Sawtelle, S. Imbach, A. Pham and Jironghe, “An automated fault detection program for multichannel bandwidth-limited system,” Proceedings of 89th ARFTG Microwave Measurement Conference (ARFTG), pp. 1-4, Honolulu, HI, 2017.
  14. B. C. Henderson, S. E. Avery, J. S. Sacks, M. S. Clements and A. Pham, “Wideband GaAs MMIC diode frequency doubler using 4:1 broadside coupled balun,” Proceedings of IEEE International Microwave Symposium, pp. 957-960, Honolulu, HI, 2017.
  15. M. Darwish and A. Pham, “An extended symmetric doherty power amplifier with high efficiency over a wide power range,” Proceedings of IEEE International Microwave Symposium, pp. 1118-1121, Honolulu, HI, 2017.
  16. D. P. Nguyen, B. L. Pham, T. Pham and A. Pham, “A 14–31 GHz 1.25 dB NF enhancement mode GaAs pHEMT low noise amplifier,” Proceedings of IEEE International Microwave Symposium, pp. 1961-1964, Honolulu, HI, 2017.
  17. T. T. Nguyen, K. Fujii and A. Pham, “A 7–42 GHz dual-mode reconfigurable mixer with an integrated active IF balun,” Proceedings of IEEE International Microwave Symposium, pp. 2018-2021, Honolulu, HI, 2017.
  18. D. P. Nguyen, B. L. Pham and A. Pham, “A compact 29% PAE at 6 dB power back-off E-mode GaAs pHEMT MMIC Doherty power amplifier at Ka-band,” Proceedings of IEEE International Microwave Symposium, pp. 1683-1686, Honolulu, HI, 2017.
  19. D. P. Nguyen, A. N. Stameroff and A. Pham, “A 1.5–88 GHz 19.5 dBm output power triple stacked HBT InP distributed amplifier,” Proceedings of IEEE International Microwave Symposium, pp. 20-23, Honolulu, HI, 2017. (Student finalist paper; Student D. Nguyen and Advisor: A. Pham)
  20. D. P. Nguyen, T. Pham and A. Pham, “A Ka-band asymmetrical stacked-FET MMIC Doherty power amplifier,” Proceedings of IEEE Radio Frequency Integrated Circuits Symposium (RFIC), pp. 398-401, Honolulu, HI, 2017.
  21. M. Darwish and A. Pham, “Compact and high efficiency Doherty power amplifier using a new modulation load range,” Proceedings of IEEE International Microwave Symposium, pp. 782-784, Honolulu, HI, 2017.
  22. Anh-Vu Pham, D. P. Nguyen and M. Darwish, “High efficiency power amplifiers for 5G wireless communications,” Proceedings of 10th Global Symposium on Millimeter-Waves, pp. 83-84, Hong Kong, 2017 (Invited).
  23. C. Van Pham, A. Pham and C. S. Gardner, “Development of helical circular coils for wireless through-metal inductive power transfer,” Proceedings of IEEE Wireless Power Transfer Conference (WPTC), pp. 1-3, Taipei, Taiwan, 2017.
  24. B. L. Pham, D. P. Nguyen, A. Pham and P. D. Le, “High power monolithic pHemt GaAs Limiter for T/R Module,” Proceedings of IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), pp. 1-4, Austin, TX, 2016.
  25. D. P. Nguyen, T. Pham, B. L. Pham and A. Pham, “A high efficiency high power density harmonic-tuned Ka-Band stacked-FET GaAs power amplifier,” Proceedings of IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), pp. 1-4, Austin, TX, 2016.
  26. T. Nguyen, A. Pham, K. Fujii and A. Riddle, “Development of a double-octave (7-34 GHz), highly linear single balanced resistive HEMT mixer using device linearization techniques,” Proceedings of IEEE International Microwave Symposium, pp. 1-4, San Francisco, CA, 2016.
  27. D. P. Nguyen, T. Nguyen and A. Pham, “Development of a highly linear Ka-band power amplifier using second harmonic injection linearization,” Proceedings of 46th European Microwave Conference (EuMC), pp. 835-838, London, UK, 2016.
  28. Thuy Nguyen, Kohei Fujii, Anh-Vu Pham, “A 6-46 GHz, high output power distributed frequency doubler using stacked FETs in 0.25um GaAs pHEMT,” Proceedings of IEEE 11th European Microwave Integrated Circuits Conference (EuMIC), 381-384, London, 2016.
  29. B. Pham, D. Nguyen, P. Le and A. Pham, “High dynamic range X-Band MMIC VGA LNA for transmit/receive module,” Proceedings of IEEE Sixth International Conference on Communications and Electronics (ICCE), pp. 1-3, Ha Long Bay, Vietnam, 2016.
  30. Y. Kitahara, C. W. Domier, M. Ikeda, A. Pham and N. C. Luhmann,. “Detection of small metal particles by a quasi-optical system at sub-millimeter wavelength,” Proceedings of SPIE Terahertz Physics, Devices, and Systems X: Advanced Applications in Industry and Defense, Vol. 9856, p. 98560H, Baltimore, MA, April 2016.
  31. B. Tobias, C. W. Domier, N. C. Luhmann Jr., C. Luo, M. Mamidanna, T. Phan, A.-V. Pham and Y. Wang. “Low-noise heterodyne receiver for electron cyclotron emission imaging and microwave imaging reflectometry.” Proceedings of the 21st Topical Conference on High-Temperature Plasma Diagnostics (HTPD), Madison, Wisconsin, USA, June, 2016.
  32. N. C. Luhmann, Jr., Yu-Ting Chang, Ming Chen, Xi Chena , C.W. Domier, J. Gu, Fengqi Hu, Xing Hu, G.J. Kramerb , Meijiao Li, X. Liu, M. Mamidanna, A.-V. Pham, T. Phan, Xiaoxin Ren, L. Shib , A.G. Spear, B. Tobiasb , and Yilun Zhu. “Advances in 2-D millimeter-wave plasma imaging of magnetic fusion plasmas,” Proceedings of 25th International TOKI Conference, Toki, Japan, 2015.
  33. B. Tobias, G. J. Kramer, E. Valeo, C.M. Muscatello, X. Ren, M. Chen, A.G. Spear, A.-V. Pham, T. Phan, M. Mamidanna, J. Lai, M. Li, D. Fu, F. Hu, C.W. Domier, N.C. Luhmann Jr., X. Chen, N. Ferraro, A. Garofalo, S. Zemedkun, T.L. Munsat, and Y. Zhu. “Microwave imaging reflectometry (MIR) on the DIII-D tokamak,” Proceedings of 1st EPS Conference on Plasma Diagnostics (ECPD)Science-ECPD, Villa Mondragone, Frascati, Italy, April, 2015.
  34. J. H. Jeon, J. T. Chang, and A. Pham, “Archimedean spiral antenna with an integrated dual bandstop response,” Proceedings of IEEE International Symposium on Antennas and Propagation, pp. 1-2, Vancouver, Canada, July 2015.
  35. C. V. Pham, B. Pham, A. Pham and R. E. Leoni, “A 46:1 bandwdith ratio balun on multilayer organic substrate,” Proceedings of IEEE International Microwave Symposium, pp. 1-3, Phoenix, AZ, May 2015.
  36. M. Mamidanna, A. Pham, and F. Montauti, “Development of a liquid crystal polymer low noise amplifier module at Ka-band,” Proceedings of IEEE International Microwave Symposium, pp. 1-3, Tampa, FL, June 2014.
  37. J. Jeon, J. Chang, and A. Pham, “Band-notched UWB equiangular spiral antenna,” Proceedings of IEEE International Symposium on Antennas and Propagation, pp. 1-2, Memphis, TN, July 2014.
  38. J. Curtis, A.-V Pham, M. Chirala, F. Aryanfar, and P. Zhouyue, “A Ka-band doherty power amplifier with 25.1 dBm output power, 38% peak PAE and 27% back-off PAE,” Proceedings of IEEE Radio Frequency Integrated Circuit Symposium, pp. 349-352, Seattle, WA, June 2013.
  39. M. Mamidanna, A. Pham and F. Montauti, “Development of a liquid crystal polymer receiver module at Ka-band,” Proceedings of AIAA International Communications Satellite Systems Conference, pp. 1-3, Florence, Italy, October 2013.
  40. H. Ta, B. Pham, A.-V. Pham, and R. Leoni, “A 23:1 bandwidth ratio balun on multilayer organic substrate,” Proceedings of IEEE International Microwave Symposium, pp. 1-3, Seattle, WA, June 2013.
  41. B. Pham and A.-V. Pham, “Triple bands antenna and high efficiency rectifier design for RF energy harvesting at 900, 1900 and 2400 MHz,” Proceedings of IEEE International Microwave Symposium, pp. 1-3, Seattle, WA, June 2013.
  42. V. L. Duong, A.-V. Pham, T. W. Dalrymple, M. Schadt, and C. L. Palomaki, “Development of a compact true time delay circuit,” Proceedings of GOMAC, pp. 1-3, Las Vegas, NV, March 2013.
  43. A. Stameroff and A. Pham, “Wide bandwidth inverse class F power amplifier with novel balun harmonic matching network,” Proceedings of IEEE International Microwave Symposium, pp. 1-3, Montreal, Canada, June 2012 (Student finalist paper; Student A. Stameroff and Advisor: A. Pham)
  44. H.Ta and A. Pham, “Compact wilkinson power divider on multilayer organic substrate” Proceedings of IEEE International Microwave Symposium, pp. 1-3, Montreal, Canada, June 2012.
  45. S. Chieh and A. Pham, “A W-Band 8 x 8 series fed patch array on liquid crystal polymer”, Proceedings of IEEE Antennas and Propagation Society International Symposium (APSURSI), pp. 1-2, Chicago, Illinois, July 2012.
  46. B. Pham, J. S. Chieh, and A. Pham, “A wideband composite right/left-hand rectenna for UHF energy harvesting applications” Proceedings of IEEE Antennas and Propagation Society International Symposium (APSURSI), pp. 1-2, Chicago, Illinois, July 2012.
  47. J. S. Chieh and A. Pham “A bidirectional X-Band antenna array on Liquid Crystal Polymer,”Proceedings of IEEE Antennas and Propagation Society International Symposium (APSURSI), pp. 573-576, Spokane, WA, July 2011.
  48. Y. Wang, J. S. Chieh, and A. Pham, “A wideband and high gain V-band EBG patch antenna on liquid crystal polymer,” Proceedings of IEEE Antennas and Propagation Society International Symposium (APSURSI), pp.1820-1823, Spokane, WA, July 2011.
  49. J. S. Chieh, Anh-Vu Pham, T. W. Dalrymple, D. G. Kuhl, and B. B. Garber, “A light weight 8-element broadband phased array receiver on Liquid Crystal Polymer,” Proceedings of IEEE International Microwave Symposium, pp.1024-1027, Atlanta, Georgia, May 2010.
  50. A. Stameroff, A. Pham, and R. E. Leoni, “High efficiency push-pull inverse class F power amplifier using a balun and harmonic trap waveform shaping network,” Proceedings of IEEE International Microwave Symposium, pp.521-525, Atlanta, Georgia, May 2010.
  51. C. Chen and A. Pham, “K-band near-hermetic surface mount package using liquid crystal polymer for high power applications,”Proceedings of IEEE International Microwave Symposium, pp. 1280-1283, Atlanta, Georgia, May, 2010.
  52. A. Pham, “Liquid Crystal Polymer for microwave and millimeter-wave multi-layer packages and modules,” Proceedings of IEEE European Microwave Conference, pp. 352-355, Paris, France, October 2010.
  53. H. Ta, A. Stameroff, and A. Pham, “Development of a defected ground structure wide bandwidth balun on multilayer organic substrate,” Proceedings of IEEE Asia Pacific Microwave Conference (APMC), pp. 1641-1644, Yokohama, Japan, December 2010.
  54. H. Ta, and A. Pham, “Compact Wilkinson power divider based on novel via-less composite right/left-handed (CRLH) transmission lines,” Proceedings of IEEE 3rd International Conference on Communications and Electronics, pp. 313-317, Nha Trang, Vietnam, August, 2010.
  55. C. Y. Law and A. Pham, “A high-gain 60GHz power amplifier with 20dBm output power in 90nm CMOS,” Proceedings of IEEE International Solid-State Circuits Conference, pp. 426-427, San Francisco, CA, February 2010.
  56. J. S. Chieh, A.V. Pham, T. Dalrymple, K. Aihara, D. Kuhl, B. Garber, “A broadband 8-Element Phased Array Antenna Receiver on Liquid Crystal Polymer in the Ka-Band,” Proceedings of GOMAC, Reno, NV, March 2010
  57. J-C. S. Chieh and A. Pham, “Development of a broadband Wilkinson power combiner on Liquid Crystal Polymer,” IEEE Asia Pacific Microwave Conference Proceedings (APMC), 2068-2071, Singapore, December 2009.
  58. H. Ta and A. Pham, “Development of compact resonator and transmission lines based on multi-layer CRLH structure,” Proceeding of IEEE Asia Pacific Microwave Conference (APMC), pp. 127-130, Singapore, December 2009.
  59. C. Chen, K. Aihara, M. McGrath, Y. Wang and A. Pham, “Near hermetic high power package using Liquid Crystal Polymer for 4-Watt Ka-band amplifier with sparse thermal vias for cost reduction,” IMAP Proceedings of the International Symposium on Microelectronics, pp. 1-5, San Jose, CA, September 2009.
  60. M. J. Chen, Z. Zhang, A. Pham, and D. J. Hyman, “Thin-film LCP amplitude compensated long time delay circuit,” Proceedings of IEEE International Microwave Symposium, pp. 141-144, Boston, MA, June 2008.
  61. M. P. McGrath, K. Aihara, A. Pham and S. Nelson, “Development of LCP surface mount package with a bandpass feedthrough at K-band,” Proceedings of IEEE International Microwave Symposium, pp. 93-96, Boston, MA, June 2008.
  62. C. Lu, O. Charlon, M. Bracey, and A.-V. H. Pham, “Integrated balun design for dual-band WLAN a/b/g applications,” Proceedings of IEEE International on Circuits and Systems, pp. 1296-1299, Seattle, Washington, May 2008.
  63. W. Jiang, F. M. Soares, S. W. Seo, J. H. Baek, N. K. Fontaine, R. G. Broeke, J. Cao, J. Yan, K. Okamoto, F. Olsson, S. Lourdudoss, A. Pham, and S.J.B. Yoo, “A monolithic InP-Based photonic integrated circuit for optical arbitrary waveform generation,” Proceedings of IEEE Optical Fiber Communications, pp. 1-3, San Diego, CA, 2008.
  64. M. P. McGrath, K. Aihara, C. Chen, Z. Zhang, M. J. Chen and A.-V. Pham, “Liquid crystal polymer for RF and millimeter-wave multi-layer hermetic packages and modules,” Proceedings of Advanced Technology Workshop on RF and Microwave Packaging, pp. 1-4, San Diego, February, 2008. (Outstanding Student Paper)
  65. K. Aihara, A. Pham, D. Zeeb, T. Flack, and E. Stoneham, “Development of multi-layer liquid crystal polymer Ka-band receiver modules,” Proceedings of IEEE Asia Pacific Microwave Conference (APMC), pp. 1-4, Bangkok, Thailand, December 2007.
  66. M. Chen, N. Evers, C. Kapusta, J. Iannotti, W. Kornrumpf, A. Pham, J. Maciel, and N. Karabuda, “Reliability of a hermetic LCP package for RF MEMS switches,” Proceedings of GOMAC, pp. 427-430, Orlando, FL, September 2007.
  67. J. Iannotti, C. Kapusta, W. Taft, A. Jacomb-Hood, M. Chen, and A. Pham, “Wideband passive amplitude compensated true time delay (TTD) module for active phased arrays,” Proceeding of GOMAC, pp. 199-202, Orlando, FL, September 2007.
  68. S.-W Seo, F. M. Soares, J. H. Baek, W. Jiang, N. K. Fontaine, R. P. Scott, C. Yang, D. J. Geisler, J. Yan, R. Broeke, J. Cao, F. Olsson, S. Lourdudoss, A.-V. Pham, and S. J. B. Yoo, “Monolithically integrated InP photonic micro systems on a chip for O-CDMA and OAWG applications,” Proceedings of Photonics in Switching, pp. 97-98, San Francisco, CA, August 2007.
  69. A. Pham, “Development of LCP surface mount packages for Ka-band applications,” Proceedings of GOMAC, pp. 415-418, Orlando, FL, September 2007.
  70. A. Chen, A. Pham, and R. Leoni, “6-18 GHz push-pull power amplifier with wideband even-order distortion cancellation in LCP module,” Proceedings of IEEE International Microwave Symposium, pp. 1079-1082, Honolulu, HI, June 2007.
  71. K. Takata and A. Pham, “Electrical properties and practical applications of Liquid Crystal Polymer,” Proceedings of IEEE 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 67-72, Tokyo, Japan, January 2007.
  72. K. Aihara, A. Pham, and J. Roman, “Development of molded liquid crystal polymer surface mount packages for Ku and Ka-band applications,” Proceedings of International Conference and Exhibition on Device, pp. 1-3, March 2006.
  73. J. Cao, R.G. Broeke, N. Fontaine, W. Cong, C. Ji, Y. Du, N. Chubun, K. Aihara, A. Pham, S. J.B.Yoo, F. Olsson, S. Lourdudoss, and P.L. Stephan, “Error-free spectral encoding and decoding operation of InP O-CDMA encoder,” Proceedings of IEEE Optical Fiber Communications Conference, pp. 163-166, Anaheim, CA, June 2006.
  74. C. Lu, A. Pham, M. Shaw, and C. Saint, “A fully integrated broadband power amplifier with two-dimensional Linearization,” Proceedings of 36th European Microwave Conference, pp. 407-410, Manchester, UK, September 2006.
  75. Chao Lu, Anh-Vu Pham, and Michael Shaw “A CMOS power amplifier for full-band UWB transmitters,” Proceeding of IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, pp. 397 – 400, San Francisco, CA, June 2006.
  76. M. J. Chen, A. Pham, N. A. Evers, C. Kapusta, J. Iannotti, W. Kornrumpf, J. Maciel, N. Karabudak, “Development of multilayer organic modules for hermetic packaging of RF MEMS circuits,” Proceedings of IEEE International Microwave Symposium, pp. 271 – 274, San Francisco, CA, June 2006.
  77. K. Aihara and A. Pham “Development of thin-film liquid crystal polymer surface mount packages for Ka-band applications,” Proceedings of IEEE International Microwave Symposium, pp 956–959, San Francisco, CA, June 2006. (Student finalist paper; Student K. Aihara and Advisor: A. Pham).
  78. C. Lu, A. Pham, and D. Livezey, “On the linearity of CMOS multi-band phase shifters,” Proceedings of 6th topical meeting on Silicon Monolithic Integrated Circuits in RF Systems, pp. 290 – 293, San Diego, CA, January 2006.
  79. S. Lourdudoss, F.Olsson, C.A.Barrios, T.Hakkarainen, A.Berrier, S.Anand, A.Aubert, J.Berggren, R. G. Broeke, J. Cao, N. Chubun, S-W Seo, J-H Baek, N. Chubun, K. Aihara, Anh-Vu Pham, S.J.Ben Yoo, M. Avella, and J. Jiménez, “Heteroepitaxy and selective epitaxy for discrete and integrated devices,” Proceedings of IEEE Conference on optoelectronic and microelectronic materials and devices (COMMAD’06) , pp. 1-2, Perth, Australia, December 2006.
  80. M. McGrath and A. Pham, “Microwave vertically aligned carbon nanotube array sensors for ammonia detection,” Proceedings of IEEE Sensors, pp. 837-841, Irvine, CA, November 2006.
  81. K. Aihara, A.C. Chen, A. Pham, and J.W. Roman, “Development of molded liquid crystal polymer surface mount packages for millimeter wave applications,” Proceedings of 14th IEEE Electrical Performance of Electronic Packaging, pp. 167–170, Austin, TX, October 2005.
  82. C. Lu, A. Pham, and D. Livezey, ” A Novel Multi-band Phase Shifter with Loss Compensation in 180 nm RF CMOS Technology,” Proceedings of IEEE International Midwest Symposium on Circuits and Systems, pp. 806-809, Cincinnati, OH, August 2005.
  83. M. Chen, N. Evers, C. Kapusta, J. Iannotti, A. Pham, W. Kornrumpf, J. Maciel, N. Karabudak, “Development of a hermetically sealed enclosure for MEMS in chip-on-flex modules using liquid crystal polymer (LCP),” Proceedings of ASME Interpack, San Francisco, CA, July 2005.
  84. A. Keerti, and A. Pham, “Dynamic output phase to adaptively improve the linearity of the power amplifier under antenna mismatch,” Proceedings of IEEE Radio Frequency Integrated Circuits (RFIC), pp. 675 – 678, Long Beach, CA, June 2005.
  85. A. C. Chen, A. Pham, and R. E. Leoni, “Development of a low-loss multilayered broadband balun using twin-thickness thin film”, Proceedings of IEEE International Microwave Symposium, pp. 1243-1246, Long Beach, CA, June 2005.
  86. A. C. Chen, M. Chen, A. Pham, “Development of microwave ultra-wide band balun using liquid crystal polymer flex,” Proceedings of 55th IEEE Electronic Components and Technology, pp. 783-787, Orlando, FL, June 2005.
  87. Mark P. McGrath, Ridah N. Sabouni, and A. Pham, “Development of nano-based resonator gas sensors for wireless sensing systems,” Proceedings of SPIE Nanosensing Materials and Devices, pp. 62-72, Philadelphia, PA, October 2004.
  88. A. Pham, “Remote wireless carbon nanotube sensors,” Proceedings of IEEE Topical Conference on Wireless Communication Tech., pp. 233-236, Honolulu, HI, October 2003. (Invited)
  89. Z. Wei and A. Pham, “Liquid crystal polymer (LCP) for microwave/millimeter wave multi-layer packaging,” Proceedings of IEEE International Microwave Symposium, pp. 2273-2276, Philadelphia, PA, June 2003.
  90. K. Aihara, J. Xiang, S. Chopra, A. Pham, and A. M. Rao, “GHz carbon nanotube resonator bio-sensors,” Proceedings of IEEE Nanotechnologies Conference, pp. 12-14, San Francisco, August 2003.
  91. A. Pham, “Educational modules on RF MEMS and microsystems,” Proceedings of IEEE Electronic Components and Technology Conference, pp. 495-497, New Orleans, May 2003.
  92. A. Pham, “Remote wireless carbon nanotube sensors,” NSF Workshop at the IEEE Topical Conference on Wireless Communication Technology, October 2003, pp. 233-236 (Invited).
  93. Z. Wei and A. Pham, “Liquid crystal polymer (LCP) for microwave/millimeter wave multi-layer packaging,” Proceedings of IEEE International Microwave Symposium, pp. 2273-2276, Philadelphia, PA, June 2003.
  94. K. Aihara, J. Xiang, S. Chopra, A. Pham, and A. M. Rao, “GHz carbon nanotube resonator bio-sensors,” Proceedings of IEEE Nanotechnologies Conference, San Francisco, August 2003.
  95. A. Pham, “Educational modules on RF MEMS and microsystems,” Proceedings of IEEE Electronic Components and Technology Conference, pp. 495-497, New Orleans, May 2003.
  96. A. Venkateshan, A. Pham, and J. Harriss, “Development of an organic micromachined isolation scheme for wafer-level packaging,” Proceedings of IEEE Electrical Performance of Electronic Packaging Conference, Monterey, CA, Oct. 2002.
  97. R. Ramachandran and A. Pham, “Development of an organic wafer-level packaging platform for highly integrated RF transceivers,” Proceedings of IEEE International Microwave Symposium, pp. 1401-1404, Seattle, WA, June 2002.
  98. S. Thumaty, A. Pham, and H. van Wyk, “Development of a low-IF receiver and a fixed wireless utility network,” Proceedings of IEEE International Microwave Symposium, pp. 449-452, Seattle, WA, June 2002.
  99. S. Chopra, A. Pham, J. Gaillard, A. M. Rao, “Nano-based Resonant Circuit Gas Sensors,” Proceedings of American Physics Society Meeting, Indianapolis, IN, March 2002.
  100. A. Pham, “Educational Project: Development of a seminar course on RF MEMs and RF Microsystems,” Proceedings of IEEE Electronic Components and Technology Conference, pp. 1401-1404, San Diego, CA, May 2002.
  101. S. Chopra, A. Pham, J. Gillard, and A. M. Rao, “Development of RF carbon nanotube resonant circuit sensors for gas remote sensing applications,” Proceedings of IEEE International Microwave Symposium, pp. 639-642, Seattle, WA, June 2002. (Student finalist paper; Student S. Chopra and Advisor: A. Pham).
  102. S. Manohar, A. Pham, N. Evers, “Empirical large signal model for SiC MESFETs,” Proceedings of IEEE ARFTG Conference, Seattle, WA, June 2002.
  103. S. Manohar, A. Narayanan, A. Keerti, A. Pham, R. Borges, and K. Linthicum, “Characteristics of microwave power GaN HEMTs on large-scale Si wafers,” Proceedings of IEEE International Microwave Symposium, pp. 1401-1404, Seattle, WA, June 2002.
  104. R. Ramachandran, D. Newlin and A. Pham, “Development of RF/Microwave on-chip inductors using an organic micromachining process,” Proceedings of IEEE Electrical Performance of Electronic Packaging Conference, Cambridge, MA, pp. 97-100, October. 2001.
  105. N. Chomnawang, Sangwon Park, Kabseog Kim, J-B. Lee, and A. Pham, “On-chip RF MEMS components for high frequency applications,” Proceedings of Texas MEMS III Conference, Richardson, TX, June 2001.
  106. D. Newlin, A. Pham, J. Harriss, and J. B. Lee, “Development of low loss organic micromachined interconnects on Silicon at microwave frequencies,” Proceedings of IEEE RAWCON Conference, pp. 181-183, Boston, MA, August 2001.
  107. D. Newlin, A. Pham, J. Harriss, and J. B. Lee, “Development of organic-micromachined interconnects on Si substrates at microwave frequencies,” Proceedings of 34th International Symposium on Microelectronics, pp. 44-47, Baltimore, MD, October 2001.
  108. A. Pham, J. Laskar, V. Krishnamurthy, D. Bates, W. Marcinkewicz, B. Schmanski, P. Piacente, and L. Sprinceanu, “Development of a millimeter wave system-on-a-package utilizing MCM integration,” Proceedings of IEEE Electrical Performance of Electronic Packaging Conference, pp. 277-280, Tempe AZ, October 2000.
  109. S. Manohar, A. Pham, V. Krishnamurthy, D. Bates, W. Marcinkewicz, B. Schmanski, P. Piacente, and L. Sprinceanu “Development of microwave/millimeter wave integral passives for multi-layer organic MCMs,” Proceedings of IEEE International Microwave Symposium, pp. 1879-1882, Boston MA, June 2000.
  110. J. E. Harriss, L. W. Pearson, X. Wang, C. H. Barron, and A. Pham, “Membrane-supported Ka-band resonator employing organic micromachined packaging,” Proceedings of IEEE International Microwave Symposium, pp. 1225-1228, Boston MA, June 2000.
  111. A. Pham, A. Sutono, J. Laskar, V. Krishnamurthy, D. Lester, E. Balch, and J. Rose, “Development of vertical interconnects for mixed substrate technology,” Proceedings of IEEE 54th ARFTG Conference, pp. 132-136, Atlanta GA, December 1999.
  112. A. Sutono, A. Pham, J. Laskar, and W. R. Smith, “Development of three dimensional ceramic-based MCM inductors for hybrid RF/Microwave applications,Proceedings of IEEE Radio Frequency Integrated Circuits Symposium (RFIC), pp. 175-178, Baltimore, MD, June 1999.
  113. J. Laskar, A Sutono, A Pham, D. Staiculescu, H. Liang, D. Cresci, “Development of board level electrical models for vertical Interconnects and embedded components at microwave frequencies,” Proceedings of 26th General Assembly of the International Union of Radio Science, Toronto, Canada, August 1999. (invited paper)
  114. A. Sutono, A. Pham, J. Laskar, and W. R. Smith, “Investigation of multi-layer ceramic based MCM technologies,” Proceedings of 7th IEEE Electrical Performance of Electronic Packaging Conference, pp. 83-86, West Point, NY, October 1998.
  115. A. Pham, A. Mathis, J. Laskar, A. F. Peterson, and L. Hayden, “Membrane probe technology for non-destructive thin-film material characterization,” Proceedings of IEEE International Microwave Symposium, pp. 957-960, Denver, CO, June 1998.
  116. A. Pham, A. Sutono, J. Laskar, V. Krishnamurthy, H.S. Cole, and T. Sitnik-Nieters, “Development of millimeter wave multi-layer organic based MCM technology,” Proceedings of IEEE International Microwave Symposium, pp. 1103-6, Denver, CO, June 1998.
  117. D. Staiculescu, A. Pham, J. Laskar, S. Consolazio, S. Moghe, and J. Mondal, “Analysis and performance of BGA interconnects for RF packaging,” Proceedings of IEEE Radio Frequency Integrated Circuits Symposium (RFIC), pp. 131-4, Denver, CO, June 1998.
  118. J. Laskar, N. Jokerst, M. Brooke, M. Harris, C. Chun, A. Pham, H. Liang, D. Staiculescu, and A. Sutono, “Review of RF packaging at Georgia Tech’s PRC,” Proceedings of 4th International Symposium on Advanced Packaging Materials Processes, pp. 139-150, Braselton, GA, March 1998.
  119. A. Pham, J. Laskar, V. Krishnamurthy, H. Cole, and T. Sitnik-Nieters, “Ultra low loss millimeter wave MCM interconnects,” Proceedings of 6th IEEE Electrical Performance of Electronic Packaging Conference, pp. 213-216, Napa, CA, Oct. 1997.
  120. A. Pham, J. Laskar, S. Basu, and J. Pence, “Comparison of coplanar microprobes for on-wafer measurement at millimeter wave frequencies,” Proceedings of IEEE International Microwave Symposium, pp. 1659-1662, Denver, CO, June 1997.
  121. A. Pham, C. Chun, J. Laskar, and B. Hutchison, “Surface mount microwave package characterization technique,” Proceedings of IEEE International Microwave Symposium, pp. 995-998, Denver, CO, June 1997.
  122. P. Chahal, A. Haridass, A. Pham, R. Tummala, M. Allen, J. Laskar, and M. Swaminathan, “Integration of thin film passive circuits using high/low dielectric constant,” Proceedings of 47th IEEE Electronic Components and Technology Conference, pp. 739-744, May 1997.
  123. A. Pham, J. Laskar, G. Zhou, and B. Hutchison, “Development of a surface mountable plastic package characterization technique,” Proceedings of 5th IEEE Electrical Performance of Electronic Packaging Conference, pp. 147-149, San Jose, CA, October 1996.
  124. A. Pham, J. Laskar, and J. Schappacher, “Development of on-wafer microstrip characterization techniques,” Proceedings of 47th IEEE ARFTG Conference, pp. 85-94, San Francisco, CA, June 1996.

BOOK

  1. Laskar, S. Chakraborty, A. Pham, and M. M. Tentzeris, Advanced Mixed Signal Communications Systems, Hoboken, New Jersey, Wiley-Interscience, 450pp. (ISBN-10: 0471709603), 2009.
  2. Anh-Vu Pham, Morgan J. Chen, and Kinia Aihara, LCP for Microwave Packages and Modules, Cambridge, UK, Cambridge University Press, ISBN 978-1-107-00378, 2012.

BOOK CHAPTERS

  1. S. Manohar, A. Pham, J. Brown, R. Borges, and K. Linthicum, Microwave GaN-based Power Transistors on Large-Scale Silicon Wafers, in Compound Semiconductor Integrated Circuits, edited by Tho Vu, World Scientific, 2003 (Invited).
  2. M.P.McGrath, K.Aihara, M.J.Chen and A.Pham, Liquid Crystal Polymer for RF and Millimeter-Wave Multi-layer Hermetic Packages and Modules in RF and Microwave Microelectronics. Springer, 26pp. (ISBN:978-1-4419-0983-1)

SELECTED INVITED TALKS

  1. A. Pham, “RF Module Integration for Wireless Communications Applications”, Rutgers University, New Jersey, December 2001.
  2. A. Pham, “RF Module Integration for Wireless Communications Applications”, University of Washington, Seattle WA, March 2002.
  3. A. Pham, “RF Module Integration for Wireless Communications Applications” Raytheon RRFC, Andover, MA, March 2002.
  4. A. Pham, “A platform for developing highly integrated transceivers,” IEEE International Microwave Symposium Workshop, Seattle, WA, June 2002.
  5. A. Pham, “Organic Micromachining Techniques for Microwave Components,” Motorola SPS, Tempe AZ, July 2002.
  6. A. Pham, “Packaging for radio frequency components and sub-systems,” IEEE GaAs IC Conference Panel, Monterey, CA, Oct. 2002.
  7. A. Pham, “LTCC and 3-D Integration for Microwave Modules”, Intel Corporation, Santa Clara, CA, 2003.
  8. A. Pham, “Microwave/millimeter wave multi-layer organic system-on-a-package,” DARPA Workshop on 3-D Micro Electromagnetic RF Systems, Dulles, VA, March 2003.
  9. A. Pham, “Microwave/millimeter-wave multi-layer organic system-on-a-package.” Air Force Research Laboratory, Wright Patterson, August 2003.
  10. A. Pham, “Microwave and millimeter wave polymer-based packaging,” IEEE International Microwave Symposium Workshop, Philadelphia, PA, June 2003.
  11. A. Pham, “Remote wireless carbon nanotube sensors,” NSF Workshop at the IEEE Topical Conference on Wireless Communication Technology, Honolulu, HI, October 2003.
  12. A. Pham, “Microwave/millimeter-wave multi-layer organic system-on-a-package.” Endwave Corporation, San Jose, CA, December 2003.
  13. A. Pham, “RF and millimeter wave multi-layer LCP modules and MEMS packaging,” IEEE International Microwave Symposium Workshop, Long Beach, CA, June 2005.
  14. A. Pham, “Compact and high-density hermetic modules for microwave and millimeter wave applications,” IEEE International Microwave Symposium Workshop, San Francisco, CA, June 2006.
  15. A. Pham, “LCP for microwave and Millimeter wave packaging,” Japan Printed Circuit Association, Tokyo, Japan, January 2006.
  16. A. Pham, “LCP for microwave and Millimeter wave packaging,” Agilent Technologies, Santa Rosa, CA, May 2006.
  17. A. Pham, “LCP for microwave and Millimeter wave packaging,” IEEE MTT Chapter, New Hampshire Section, October 2006.
  18. A. Pham, “LCP for microwave and Millimeter wave packaging,” General Electric Global Research Lab, October 2006.
  19. A. Pham, “Compact and high-density hermetic modules for microwave and millimeter-wave applications,” 39TH IMAPS International Symposium on Microelectronics, June 2006.
  20. A. Pham, “Channel modeling for 10 GB Ethernet over copper technologies,” IEEE International Microwave Symposium Workshop, San Francisco, CA, June 2006.
  21. A. “Development of millimeter-wave surface mount packages,” Emerging Packaging Technology and Applications at Millimeter Wave Frequencies, IEEE International Microwave Symposium, Honolulu, HI, June 2007.
  22. A. Pham, “Liquid Crystal Polymer for components and modules for communications,” CITRIS in Asia Research Symposium, Taipei, Taiwan, 2007.
  23. A. Pham, “LCP for microwave and Millimeter wave packaging,” IEEE Radio and Wireless Symposium, Workshop on Advances for RF Packaging, January 2008.
  24. A. Pham, “Liquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,” IEEE MTT Chapter, Tempe, AZ, March 2008.
  25. A. Pham, “Liquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,” IMAPS Advanced Technology Workshop on RF and Microwave Packaging, September 2008.
  26. A. Pham, “Liquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,” Georgia Electronics Design Center, Georgia Institute of Technology, April 2008.
  27. A. Pham, “Liquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,” Berkeley Sensor and Actuator Center, University of California, Berkeley, March 2008.
  28. A. Pham, “Liquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,” Lockheed Martin, Palo Alto, CA February 2009.
  29. A. Pham, “Liquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,” IEEE MTT Chapter Dallas Section, Dallas, TX, February 2010.
  30. A. Pham, “Liquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,” IEEE MTT Santa Clara Chapter, Santa Clara, CA, May 2010.
  31. A. Pham, “Liquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,” IEEE MTT Chapter Cedar Rapids Chapter, Cedar Rapids, Iowa, May 2010.
  32. A. Pham, “Development of Ultra-small wireless passive modules using 3-D organic metamaterials,” IEEE International Microwave Symposium Workshop, Anaheim, CA May 2010.
  33. A. Pham, “Liquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,” Chang Gung University, Taojuan, Taiwan, July 2010.
  34. A. Pham, “Liquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,” IEEE 3rd International Conference on Communications and Electronics, Nha Trang, Vietnam, Keynote Speaker, August 2010.
  35. A. Pham, “Liquid Crystal Polymer for microwave and millimeter-wave multi-layer packages and modules,” IEEE European Microwave Conference, Paris, France, September 2010.
  36. A. Pham, “Liquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,” IEEE MTT Los Angeles Coastal Chapter, Los Angeles, CA, November 2010.
  37. A. Pham, “Liquid Crystal Polymer for Microwave and Millimeter Wave Multi-layer Packages and Modules,” University of Southern California, April 2012.
  38. A. Pham, “Liquid Crystal Polymer for RF and millimeter-wave multi-layer hermetic packages and modules,” IEEE MTT Baltimore Chapter, Baltimore, MD, May 2012.
  39. A. Pham, “Liquid Crystal Polymer for Microwave and Millimeter Wave Multi-layer Packages and Modules,” Polytechnique Montreal University, September 2013.
  40. A. Pham, “Liquid Crystal Polymer for Microwave and Millimeter Wave Multi-layer Packages and Modules,” Stanford University, November 2014.
  41. A. Pham, D. P. Nguyen and M. Darwish, “High efficiency power amplifiers for 5G wireless communications,” 10th Global Symposium on Millimeter-Waves, Hong Kong, May 2017.
  42. A. Pham, D. P. Nguyen and M. Darwish, “High Efficiency Power Amplifiers and Front-end Module Circuits for 5G Wireless Communications,” Front-end Module for 5G Workshop, IEEE International Microwave Symposium, Honolulu, HI, 2017.
  43. A. Pham, D. P. Nguyen and M. Darwish, “High Efficiency Power Amplifiers and Front-end Module Circuits for 5G Wireless Communications” High Efficiency mm-Wave Power Amplifiers for 5G, IEEE European Microwave Conference Workshop, Madrid, Spain, 2018.

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