AsAP: A Fine-grain Multi-core Platform for DSP Applications

Abstract:

Many emerging and future applications require significant levels of
complex digital signal processing and operate within limited power
budgets. Moreover, dramatically rising VLSI fabrication and design
costs make programmable and reconfigurable solutions increasingly
attractive. The AsAP project addresses these challenges with a chip
multiprocessor composed of simple processors with small memories,
achieving high energy efficiency and throughput in a small chip area.

Paper

  PDF (2.1 MB),   (c) Copyright, 2008 IEEE
• Table of Contents

Reference

Bevan Baas, Zhiyi Yu, Michael Meeuwsen, Omar Sattari, Ryan Apperson, Eric Work, Jeremy Webb, Michael Lai, Tinoosh Mohsenin, Dean Truong, Jason Cheung "AsAP: A Fine-grain Multi-core Platform for DSP Applications," IEEE Micro, Volume 27, Number 2, March/April 2007.

BibTeX Entry

@ARTICLE{Baas:MICRO:2007,
   author={Baas, B. and Zhiyi Yu and Meeuwsen, M. and Sattari, O. and Apperson, R. and Work, E. and Webb, J. and Lai, M. and Mohsenin, T. and Truong, D. and Cheung, J.},
   journal={Micro, IEEE}, 
   title={{AsAP}: A Fine-Grained Many-Core Platform for {DSP} Applications},
   year={2007},
   month={Mar.},
   volume={27},
   number={2},
   pages={34-45},
   doi={10.1109/MM.2007.29},
   ISSN={0272-1732}
}