| Faculty | |||
|
Professor Bevan Baas | ||
| Graduate students | |||
|
Dean Truong Ph.D. Candidate
|
|
Bin Liu Ph.D. Candidate
|
|
Aaron Stillmaker Ph.D. Student
|
|
Jon Pimentel Ph.D. Student
|
|
Jeremy Webb Ph.D. Student
|
|
Brent Bohnenstiehl Ph.D. Student
|
|
Emmanuel Adeagbo Ph.D. Student
|
||
|
Michael Braly MS Student
|
|
Nima Mostafavi MS Student
|
|
Christine Watnik MS Student
|
||
| Undergraduate Researchers | |||
|
Jonathan Earl
|
||
| Alumni | |||
| Ph.D. | |||
|
Prof. Zhiyi Yu Ph.D. ECE, Oct. 2007 Associate Professor Fudan University
|
|
Prof. Tinoosh Mohsenin Ph.D. ECE, Nov. 2010 Assistant Professor University of Maryland, Baltimore County
|
|
Dr. Anh Tran Ph.D. ECE, Aug. 2012 Senior ASIC Research Engineer A Stealth Mode Startup in San Jose
|
|
Dr. Zhibin Xiao Ph.D. ECE, Dec. 2012 Senior Hardware Engineer Software-in-Silicon R&D Group Oracle
|
| M.S. | |||
|
Ryan Apperson MS ECE, Sept. 2004 Senior Electrical Engineer Physio-Control R&D
|
|
Omar Sattari MS ECE, Sept. 2004 Software Engineer CornerTurn Instructor Allied American University
|
|
Mike Lai MS ECE, Sept. 2004 Design Engineer Altera
|
|
Mike Meeuwsen MS ECE, April 2005 Hardware Engineer Intel, Digital Enterprise Group
|
|
Toney Jacobson MS ECE, July 2007 Patent Associate Fenwick & West LLP
|
|
Eric Work MS ECE, Sept. 2007 Software Engineer S-Machines
|
|
Wayne Cheng MS ECE, January 2008 ASIC Design Engineer Uniquify
|
|
Gouri Landge MS ECE, December 2009 Intel, Digital Home Group
|
|
Stephen Le MS ECE, March 2010 Component Design Engineer Architecture Simulation Intel, Visual Computing Group
|
|
Lucas Stillmaker MS ECE, September 2011 Graphics Hardware Engineer Intel, Visual and Parallel Computing Group (VPG) Intel Architecture Group (IAG)
|
|
Trevin Murakami MS ECE, December 2011 Product Engineer Intel, NAND Solutions Group (NSG)
|
|
Houshmand Shirani Mehr MS ECE, June 2012 Media encoder design, Component Design Engineer. Intel, Visual and Parallel Computing Group (VPG HW) Media Group
|
| Undergraduate Researchers | |||
|
Henna Huang BS ECE, June 2009 Ph.D. Student MIT
|
|
Gary Chung BS ECE, August 2009 Apple Computer
|
|
Brian Zimmer BS ECE, June 2010 Ph.D. Student UC Berkeley
|
|
Layne Miao BS ECE, June 2011 Analog Design Engineer Intel Corporation
|
|
Victoria Harvey BS ECE, June 2012 Ph.D. Student Stanford
|
||
|
|||
Many members of the VCL are participating in work on the circuits, functional
units, architecture, interconnection network, algorithms, and applications
for a high-performance and energy-efficient processing system targeting
computationally-demanding multi-algorithm DSP system applications.
The single-chip processing system is comprised of a large number of
fine-grain asynchronously-operating programmable processors connected
by a reconfigurable 2-dimensional mesh network.
AsAP 1. The 0.18 μm AsAP 1 chip contains
36 programmable processors, operates at over 610 MHz at 2.0 V,
and is believed to be the second highest clock rate processor designed in any
university. Details of the chip were presented in the Technology
and Architecture Directions session at ISSCC in Feb. 2006. See the
paper below.
Also see the EE Times article
"Asynchronous array of processors chip presented at ISSCC 2006,"
February 9, 2006.
AsAP 2. A second generation 65 nm CMOS
design contains 167 processors with dedicated FFT, Viterbi, and video
motion estimation processors; 16 KB shared memories; and long-distance
inter-processor interconnect. The programmable processors can individually
and dynamically change their supply voltage and clock frequency. The chip
is fully-functional. Processors operate up to 1.2 GHz at 1.3 V which
is believed to be the highest clock rate fabricated processor designed
in any university. At 1.2 V, they operate at 1.07 GHz and 47 mW when
100% active. At 0.675 V, they operate at 66 MHz and 608 μW when 100%
active. This operating point enables 1 trillion MAC or ALU ops/sec with
a power dissipation of only 9.2 Watts. Due to its MIMD architecture and
fine-grain clock oscillator stalling, this energy efficiency per operation
is almost perfectly constant across widely varying workloads--which is
not the case for many architectures.
![]() |
National Science Foundation • CCF Grant No. 1018972 • REU Grant 2010 • CCF Grant No. 0903549 • CAREER award No. 0546907 • REU Grant 2005 • CCF Grant No. 0430090 • CCF Grant No. 0312837 (Co-PI) |
![]() |
SRC, Semiconductor Research Corporation • GRC Grant 2321.001 • GRC Grant 1971.001 • CSR Grant 1659.001 • GRC Grant 1598.001 |
![]() |
UC MICRO | ![]() |
ST Microelectronics |
![]() |
C2S2 • Grant 2047.002.014 |
|
Intellasys Corporation |
![]() |
Intel Corporation | SEM | SEM |
![]() |
Committee on Research, Faculty Research Grant | ![]() |
Fudan University |
![]() |
Xilinx Incorporated, Equipment grants |
![]() |
Atheros Communications, Equipment grant |
| We also acknowledge support from: • Artisan • MOSIS |
|||
| Any opinions, findings and conclusions or recomendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation (NSF). | |||
| The authors acknowledge the support of the C2S2 Focus Center, one of six research centers funded under the Focus Center Research Program (FCRP), a Semiconductor Research Corporation entity. | |||
2013