Publications

For further information, please contacted the respective authors as listed under

REFERRED JOURNALS

  1. M. J. Chen, A. Pham, N. A. Evers, C. Kapusta, J. Iannotti, W. Kornrumpf, J. Maciel, N. Karabudak, “Multilayer organic multi-chip module implementing hybrid microelectromechanical systems,” under review in IEEE Transactions on Microwave Theory and Techniques, June 2007.pdf
  2. C. Lu, A. Pham, M. Shaw, and C. Saint, “Linearization of CMOS Broadband Power Amplifiers through Combined Multi-gated Transistors and Capacitance Compensation,” to appear in IEEE Transactions on Microwave Theory and Techniques, November 2007.pdf
  3. J. Cao, R.G.Broeke, N.K.Fontaine, C. Ji, Y. Du, N. Chubun, K. Aihara, A. Pham, F. Olsson, S. Lourdudoss, and S.J.B. Yoo, “Implementation of chip-scale InP O-CDMA encoder in a 60 Gb/s SPECTS O-CDMA testbed,” accepted for publication in IEEE Photonic Technology Letters, April 2007.pdf
  4. R. G. Broeke, J. Cao, C. Ji, Sang-Woo Seo, Y. Du, N. K. Fontaine, Jong-Hwa Baek, John Yan, F. M. Soares, F. Olsson, S. Lourdudoss, A. V. Pham, M. Shearn, A. Scherer, S. J. B. Yoo, “Optical-CDMA in InP,” accepted for publication in IEEE Journal of IEEE Journal of Selected Topics in Quantum Mechanics, Sept. 2006.pdf
  5. A. C. Chen, M. J. Chen and A. Pham, “Development of an RF ultra-wide band balun in multi-layer liquid crystal polymer flex,” to appear in IEEE Transactions on Advanced Packaging, May 2007.pdf
  6. S. J. B. Yoo, J. P. Heritage, V. Hernandez, R. Scott, W. Cong, N. Fontaine, R. Broeke, J. Cao, S.-W. Seo, J.-H. Baek, F. Soares, Y. Du, C. Yang, W. Jiang, K. Aihara, Z. Ding, B. Kolner, A.-V Pham, S. Lin, F. Olsson, Y. Sun, S. Lourdudoss, K.Y. Liou, S.N.G. Chu, R. Hamm, B. Patel, W.S. Hobson, J. R. Lothian, S. Vatanapradit, L. Gruezke, W. T. Tsang, M. Shearn, and A. Scherer “Spectral phase encoded time spread (SPECTS) optical code division multiplex access technology for next generation communication networks,” invited in OSA Journal of Optical Networks, April 2007.pdf
  7. A. Keerti and A.-V Pham, “RF characterization of SiGe HBT power amplifiers under load mismatch,” IEEE Transactions on Microwave Theory and Techniques, Vol. 55, Issue 2, pp. 207–214, February 2007.pdf
  8. J. Cao, R. G. Broeke, N. K. Fontaine, C. Ji, Y. Du, N. Chubun, K. Aihara, A.-V. Pham, F. Olsson, S. Lourdudoss, S. J. B. Yoo, “Demonstration of spectral phase O-CDMA encoding and decoding in monolithically integrated arrayed-waveguide-grating-based encoder,” IEEE Photonics Technology Letters, Vol. 18, Issue 24, pp. 2602-2604, Dec. 15, 2006.pdf
  9. M. Mcgrath and A. Pham, “Carbon nanotube based microwave resonator gas sensors,” International Journal of High Speed Electronics and Systems, vol. 16, no. 4, pp. 913-935, December 2006. (Invited)pdf
  10. M. J. Chen, A. Pham, N. A. Evers, C. Kapusta, J. Iannotti, W. Kornrumpf, J. Maciel, N. Karabudak, "Design and Development of a package using LCP for RF/Microwave MEMS switches," IEEE Transaction on Microwave Theory and Techniques, Vol. 54, Issue 11, pp.4009-4015, Nov. 2006.pdf
  11. Chao Lu, A. Pham, and Darrell Livezey, "On the feasibility of CMOS multi-band phase shifters for multiple-antenna transmitters," IEEE Microwave and Wireless Components Letters, Vol. 16, pp. 255 - 257, Issue 5, May 2006.pdf
  12. A. Keerti, J. Xiang, and A. Pham, "High power linearized RF phase shifter using anti-series diodes," IEEE Microwave and Wireless Components Letters, Vol. 16, Issue 4, pp. 200 - 202, April 2006.pdf
  13. C. Lu, A. Pham, and Darrell Livezey, "Development of multi-band phase shifters in 180 nm RF CMOS technology with active loss compensation," IEEE Transactions on Microwave Theory and Tech., Vol. 54, Issue 1, pp. 40 – 45, Jan. 2006.pdf
  14. A. C. Chen, A. Pham, and R. E. Leoni, III, "Development of low-loss, broadband planar baluns using multilayered organic thin-films," IEEE Transactions on Microwave Theory and Techniques, Vol. 53, Issue11, pp. 3648-3655, Nov. 2005.pdf
  15. S. Chopra, K. McGuire, N. Gothard, A. M. Rao, and A. Pham, “Selective gas detection using a carbon nanotube sensor,” Applied Physics Letters, vol. 38, no. 11, pp. 2280 - 2282, September 2003.pdf
  16. A. Keerti and A. Pham, “SiGe power devices for 802.11a wireless LAN applications at 5 GHz,” IEE Electronics Letters, vol. 39, no. 16, pp. 1218-1220, August 2003.pdf
  17. S. Chopra, K. McGuire, N. Gothard, A.M. Rao, and A. Pham, “Selective gas detection using a carbon nanotube sensor,” Applied Physics Letters, vol. 38, no. 11, September 2003.pdf
  18. S. Manohar, A. Pham, J. Brown, R. Borges, and K. Linthicum, “Microwave GaN-based power transistors on large-scale silicon wafers,” International Journal of High Speed Electronics and Systems, vol. 13, no. 1, pp. 265-275, 2003 (Invited)
  19. S. Manohar, A. Pham, and N. Evers "Direct determination of the bias-dependent series parasitic elements in SiC MESFETs," IEEE Transactions on Microwave Theory and Techniques, vol. 51, pp. 597-600, Feb. 2003.pdf
  20. D. Newlin, A. Pham, and J. Harriss, "Development of low loss organic-micromachined interconnects on silicon at microwave frequencies," IEEE Transactions on Components and Packaging Technologies, vol. 25, pp. 506-510, September 2002.pdf
  21. S. Chopra, A. Pham, J. Gaillard, A. Parker, and A. M. Rao, “Carbon-nanotube-based resonant-circuit sensor for ammonia,” Applied Physics Letters, vol. 80, no. 24, p. 4632, June 2002.pdf
  22. R. Ramachandran and A. Pham, "Development of RF/Microwave on-chip inductors using an organic micromachining process," IEEE Transactions on Advanced Packaging, vol. 25, pp. 244-247, May 2002.pdf
  23. A. Pham, V. Krishnamurthy, D. Bates, W. Marcinkewicz, B. Schmanski, P. Piacente, and L. Sprinceanu, "Development of integral passive components for multilayer organic MCMs at millimeter wave frequencies," IEEE Transaction on Advanced Packaging, vol. 25, pp. 98-101, Feb. 2002.pdf
  24. A. Pham, R. Ramachandran, J. Laskar, V. Krishnamurthy, D. Bates, W. Marcinkewicz, B. Schmanski, P. Piacente, and L. Sprinceanu, "Development of a millimeter wave system on a package utilizing an MCM process," IEEE Transactions on Microwave Theory and Techniques, pp. 1747-1749, Oct. 2001.pdf
  25. A. Pham, A. Sutono, J. Laskar, V. Krishnamurthy, D. Lester, E. Balch, and J. Rose, "Development of microwave multilayer plastic-based multichip modules,” IEEE Transactions on Advanced Packaging, pp. 37-40, Feb. 2001.pdf
  26. A. Sutono, A. Pham, J. Laskar, and W. R. Smith, "RF/microwave characterization of multilayer ceramic-based MCM technology" IEEE Transactions on Advanced Packaging, pp. 326-331, August 1999.pdf
  27. A. Pham, J. Laskar, V. Krishnamurthy, H. Cole, and T. Sitnik-Nieters, "Ultra low loss millimeter wave multichip module interconnects," IEEE Transactions on Component Packaging Manufacturing Technologies, vol. 21, pp. 302-308, August 1998.pdf
  28. C. Chun, A. Pham, B. Hutchison, and J. Laskar "Development of microwave package models utilizing on-wafer measurement techniques," IEEE Transactions Microwave Theory Techniques, pp.1948-1954, October 1997.pdf

JOURNALS IN PREPARATION

  1. K. Aihara and A. Pham, “Development of thin-film liquid crystal polymer surface mount packages for Ka-band applications,” to be submitted to IEEE Transactions on Microwave Theory and Techniques, September 2007.
  2. C. Chao and A. Pham, “Development of a CMOS transmitter amplifier for full-band ultra-wide band applications,” to be submitted to IEEE Transactions on Microwave Theory and Techniques, September 2007.
  3. K. Aihara, A. Pham, and J. Roman, “Development of LCP-molded packages for microwave applications,” to be submitted to IEEE Transactions on Advanced Packaging, September 2007.
  4. A. Keerti and A. Pham, “Development of dynamically adaptive phase tuning power amplifiers,” to be submitted to IEEE Transactions on Microwave Theory and Techniques,, September 2007.
  5. C. Law, M. Mcgrath, and A. Pham, “5.8-GHz Passive RFID using Inverted-F Antenna and Strain Gauge Sensor for Rotary Monitoring Applications,” to be submitted to IEEE Sensors Journal, September 2007.
  6. M. McGrath and A. Pham, “Microwave Vertically Aligned Carbon Nanotube Array Sensors for Ammonia Detection,” to be submitted to IEEE Microwave and Wireless Components Letters, September 2007.
  7. M. McGrath and A. Pham, “A Wireless sensing system with carbon nanotube resonator sensors,” to be submitted to IEEE Sensors Journal, September 2007.

REFERRED CONFERENCE PROCEEDINGS

  1. M. Chen, N. Evers, C. Kapusta, J. Iannotti, W. Kornrumpf, A. Pham, J. Maciel, and N. Karabuda, “Reliability of a hermetic LCP package for RF MEMS switches,” in Proceedings of GOMAC, Orlando, FL, September 2007, pp. 427-430.
  2. J. Iannotti, C. Kapusta, W. Taft, A. Jacomb-Hood, M. Chen, and A. Pham, “Wideband passive amplitude compensated true time delay (TTD) module for active phased arrays,” in Proceeding of GOMAC, Orlando, FL, September 2007, pp. 199-202.
  3. A. Pham, “Development of LCP surface mount packages for Ka-band applications,” in Proceedings of GOMAC, Orlando, FL, September 2007, pp. 415-418.
  4. A. Chen, A. Pham, and R. Leoni, “6-18 GHz push-pull power amplifier with wideband even-order distortion cancellation in LCP module,” in IEEE International Microwave Symposium, Honolulu, HI, June 2007, pp. 1079-1082.pdf
  5. K. Aihara, A. Pham, and J. Roman, “Development of molded liquid crystal polymer surface mount packages for Ku and Ka-band applications,” in Proceedings of International Conference and Exhibition on Device, pp. 1-3, March 2006.
  6. J. Cao, R.G. Broeke, N. Fontaine, W. Cong, C. Ji, Y. Du, N. Chubun, K. Aihara, A. Pham, S. J.B.Yoo, F. Olsson, S. Lourdudoss, and P.L. Stephan, “Error-free spectral encoding and decoding operation of InP O-CDMA encoder,” in Proceedings of Optical Fiber Communications Conference, Anaheim, CA, June 2006, pp. 163-166.
  7. C. Lu, A. Pham, M. Shaw, and C. Saint, “A fully integrated broadband power amplifier with two-dimensional Linearization,” in Proceedings of 36th European Microwave Conference, Manchester, UK, Sep. 2006, pp. 407-410.
  8. Chao Lu, Anh-Vu Pham, and Michael Shaw "A CMOS power amplifier for full-band UWB transmitters," in Proceeding of IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, San Francisco, CA, June 2006, pp. 397 - 400.
  9. M. J. Chen, A. Pham, N. A. Evers, C. Kapusta, J. Iannotti, W. Kornrumpf, J. Maciel, N. Karabudak, "Development of multilayer organic modules for hermetic packaging of RF MEMS circuits," in IEEE International Microwave Symposium(IMS), San Francisco, CA, June 2006, pp. 271 – 274.
  10. K. Aihara and A. Pham "Development of thin-film liquid crystal polymer surface mount packages for Ka-band applications," in IEEE International Microwave Symposium (IMS), San Francisco, CA, June 2006, pp 956 – 959. (Student finalist paper; Student K. Aihara and Advisor: A. Pham).pdf
  11. C. Lu, A. Pham, and D. Livezey, "On the linearity of CMOS multi-band phase shifters," in 6th topical meeting on Silicon Monolithic Integrated Circuits in RF Systems Digest, San Diego, CA, January 2006, pp. 290 - 293.
  12. M. McGrath and A. Pham, “Microwave vertically aligned carbon nanotube array sensors for ammonia detection,” in IEEE Sensors, Irvine, CA, Nov. 2006, pp. 837-841.
  13. K. Aihara, A.C. Chen, A. Pham, and J.W. Roman, "Development of molded liquid crystal polymer surface mount packages for millimeter wave applications," in 14th IEEE Electrical Performance of Electronic Packaging Digest, Austin, TX, Oct. 2005, pp. 167 – 170.
  14. C. Lu, A. Pham, and D. Livezey, " A Novel Multi-band Phase Shifter with Loss Compensation in 180 nm RF CMOS Technology," in IEEE International Midwest Symposium on Circuits and Systems Digest, Cincinnati, OH, Aug. 2005, pp. 806-809.
  15. M. Chen, N. Evers, C. Kapusta, J. Iannotti, A. Pham, W. Kornrumpf, J. Maciel, N. Karabudak, "Development of a hermetically sealed enclosure for MEMS in chip-on-flex modules using liquid crystal polymer (LCP),” in ASME Interpack, San Francisco, CA, July 2005.
  16. A. Keerti, and A. Pham, "Dynamic output phase to adaptively improve the linearity of the power amplifier under antenna mismatch," in IEEE Radio Frequency Integrated Circuits (RFIC) Digest, Long Beach, CA, June 2005, pp. 675 - 678.
  17. A. C. Chen, A. Pham, and R. E. Leoni, "Development of a low-loss multilayered broadband balun using twin-thickness thin film", in IEEE International Microwave Symposium (IMS) Digest, Long Beach, CA, June 2005, pp. 1243-1246.
  18. A.C. Chen, M. Chen, A. Pham, "Development of microwave ultra-wide band balun using liquid crystal polymer flex,” in Proceedings of 55th IEEE Electronic Components and Technology, Orlando, FL, June 2005, pp. 783-787.
  19. Mark P. McGrath, Ridah N. Sabouni, and A. Pham, "Development of nano-based resonator gas sensors for wireless sensing systems," in Proceedings of SPIE Nanosensing Materials and Devices, Philadelphia, PA, October 2004, pp. 62-72.
  20. A. Pham, “Remote wireless carbon nanotube sensors,” in IEEE Topical Conference on Wireless Communication Technology Digest, Honolulu, HI, October 2003, pp. 233-236. (Invited)
  21. Z. Wei and A. Pham, “Liquid crystal polymer (LCP) for microwave/millimeter wave multi-layer packaging,” IEEE International Microwave Symposium (IMS) Digest, Philadelphia, PA, June 2003, pp. 2273-2276.
  22. K. Aihara, J. Xiang, S. Chopra, A. Pham, and A. M. Rao, “GHz carbon nanotube resonator bio-sensors,” IEEE Nanotechnologies Conference, San Francisco, August 2003, pp. 12-14.
  23. A. Pham, “Educational modules on RF MEMS and microsystems,” in IEEE ECTC Conference, New Orleans, May 2003, pp. 495-497.
  24. A. Pham, “Remote wireless carbon nanotube sensors,” to be presented at NSF Workshop at the IEEE Topical Conference on Wireless Communication Technology, October 2003, pp. 233-236 (Invited).
  25. Z. Wei and A. Pham, “Liquid crystal polymer (LCP) for microwave/millimeter wave multi-layer packaging,” IEEE International Microwave Symposium (IMS) Digest, Philadelphia, PA, June 2003, pp. 2273-2276.
  26. K. Aihara, J. Xiang, S. Chopra, A. Pham, and A. M. Rao, “GHz carbon nanotube resonator bio-sensors,” IEEE Nanotechnologies Conference, San Francisco, August 2003.
  27. A. Pham, “Educational modules on RF MEMS and microsystems,” IEEE CPMT Conference, New Orleans, May 2003, pp. 495-497.
  28. A. Venkateshan, A. Pham, and J. Harriss, “Development of an organic micromachined isolation scheme for wafer-level packaging,” IEEE EPEP, Monterey, CA, Oct. 2002, pp. 111-114.
  29. R. Ramachandran and A. Pham, “Development of an organic wafer-level packaging platform for highly integrated RF transceivers,” in IEEE International Microwave Symposium (IMS) Digest, Seattle, WA, June 2002, pp. 1401-1404.
  30. S. Thumaty, A. Pham, and H. van Wyk, "Development of a low-IF receiver and a fixed wireless utility network," IEEE International Microwave Symposium Digest, Seattle, WA, June 2002, pp. 449-452.
  31. S. Chopra, A. Pham, J. Gaillard, A. M. Rao, "Nano-based Resonant Circuit Gas Sensors," in American Physics Society Meeting, Indianapolis, IN, March 2002.
  32. A. Pham, "Educational Project: Development of a seminar course on RF MEMs and RF Microsystems," in IEEE Electronic Components and Technology Conference Digest, San Diego, CA, May 2002, pp. 1401-1404.
  33. S. Chopra, A. Pham, J. Gillard, and A. M. Rao, "Development of RF carbon nanotube resonant circuit sensors for gas remote sensing applications," in IEEE International Microwave Symposium Digest, Seattle, WA, June 2002, pp. 639-642. (Student finalist paper; Student S. Chopra and Advisor: A. Pham).
  34. S. Manohar, A. Pham, N. Evers, “Empirical large signal model for SiC MESFETs,” in IEEE ARFTG Digest, Seattle, WA, June 2002.
  35. S. Manohar, A. Narayanan, A. Keerti, A. Pham, R. Borges, and K. Linthicum, "Characteristics of microwave power GaN HEMTs on large-scale Si wafers," in IEEE International Microwave Symposium Digest, Seattle, WA, June 2002, pp. 1401-1404.
  36. R. Ramachandran, D. Newlin and A. Pham, "Development of RF/Microwave on-chip inductors using an organic micromachining process," in IEEE EPEP Digest, Cambridge, MA, Oct. 2001, pp. 97-100.
  37. N. Chomnawang, Sangwon Park, Kabseog Kim, J-B. Lee, and A. Pham, "On-chip RF MEMS components for high frequency applications," in Texas MEMS III Conference, Richardson, TX, June 2001.
  38. D. Newlin, A. Pham, J. Harriss, and J. B. Lee, “Development of low loss organic micromachined interconnects on Silicon at microwave frequencies," in IEEE RAWCON Digest, Boston, MA, August 2001, pp. 181-183.
  39. D. Newlin, A. Pham, J. Harriss, and J. B. Lee, “Development of organic-micromachined interconnects on Si substrates at microwave frequencies,” in 34th International Symposium on Microelectronics Digest, Baltimore, MD, October 2001, pp. 44-47.
  40. A. Pham, J. Laskar, V. Krishnamurthy, D. Bates, W. Marcinkewicz, B. Schmanski, P. Piacente, and L. Sprinceanu, “Development of a millimeter wave system-on-a-package utilizing MCM integration,” in IEEE EPEP Digest, Tempe AZ, October 2000, pp. 277-280.
  41. S. Manohar, A. Pham, V. Krishnamurthy, D. Bates, W. Marcinkewicz, B. Schmanski, P. Piacente, and L. Sprinceanu "Development of microwave/millimeter wave integral passives for multi-layer organic MCMs," in IEEE IMS-Digest, Boston MA, June 2000, pp. 1879-1882.
  42. J. E. Harriss, L. W. Pearson, X. Wang, C. H. Barron, and A. Pham, "Membrane-supported Ka-band resonator employing organic micromachined packaging," in IEEE IMS-Digest, vol. 2, Boston MA, June 2000, pp. 1225-1228.
  43. A. Pham, A. Sutono, J. Laskar, V. Krishnamurthy, D. Lester, E. Balch, and J. Rose, "Development of vertical interconnects for mixed substrate technology," in IEEE 54th ARFTG Conference Digest, Atlanta GA, December 1999, pp. 132-136.
  44. A. Sutono, A. Pham, J. Laskar, and W. R. Smith, “Development of three dimensional ceramic-based MCM inductors for hybrid RF/Microwave applications,” in IEEE RFIC Conference Digest, Baltimore, MD, June 1999, pp. 175-178.
  45. J. Laskar, A Sutono, A Pham, D. Staiculescu, H. Liang, D. Cresci, "Development of board level electrical models for vertical Interconnects and embedded components at microwave frequencies," in 26th General Assembly of the International Union of Radio Science, Toronto, Canada, August 1999. (invited paper)
  46. A. Sutono, A. Pham, J. Laskar, and W. R. Smith, "Investigation of multi-layer ceramic based MCM technologies," in 7th IEEE Electrical Performance of Electronic Packaging Digest, West Point, NY, October 1998, pp. 83-86.
  47. A. Pham, A. Mathis, J. Laskar, A. F. Peterson, and L. Hayden, “Membrane probe technology for non-destructive thin-film material characterization," in IEEE MTT-S Digest, Denver, CO, June 1998, pp. 957-960.
  48. A. Pham, A. Sutono, J. Laskar, V. Krishnamurthy, H.S. Cole, and T. Sitnik-Nieters, “Development of millimeter wave multi-layer organic based MCM technology," in IEEE MTT-S Digest, Denver, CO, June 1998, pp. 1103-6.
  49. D. Staiculescu, A. Pham, J. Laskar, S. Consolazio, S. Moghe, and J. Mondal, “Analysis and performance of BGA interconnects for RF packaging," in IEEE RFIC Digest, Denver, CO, June 1998, pp. 131-4.
  50. J. Laskar, N. Jokerst, M. Brooke, M. Harris, C. Chun, A. Pham, H. Liang, D. Staiculescu, and A. Sutono, "Review of RF packaging at Georgia Tech's PRC," in 4th International Symposium on Advanced Packaging Materials Processes, Braselton, GA, March 1998, pp. 139-150.
  51. A. Pham, J. Laskar, V. Krishnamurthy, H. Cole, and T. Sitnik-Nieters, "Ultra low loss millimeter wave MCM interconnects," in 6th IEEE EPEP Digest, Napa, CA, Oct. 1997, pp. 213-216.
  52. A. Pham, J. Laskar, S. Basu, and J. Pence, “Comparison of coplanar microprobes for on-wafer measurement at millimeter wave frequencies," in IEEE MTT-S Digest, Denver, CO, June 1997, pp. 1659-1662.
  53. A. Pham, C. Chun, J. Laskar, and B. Hutchison, "Surface mount microwave package characterization technique," in IEEE MTT-S Digest, Denver, CO, June 1997, pp. 995-998.
  54. P. Chahal, A. Haridass, A. Pham, R. Tummala, M. Allen, J. Laskar, and M. Swaminathan, "Integration of thin film passive circuits using high/low dielectric constant," in 47th IEEE ECTC, May 1997, pp. 739-744.
  55. A. Pham, J. Laskar, G. Zhou, and B. Hutchison, "Development of a surface mountable plastic package characterization technique," in 5th IEEE EPEP Digest, San Jose, CA, October 1996, pp. 147-149.
  56. A. Pham, J. Laskar, and J. Schappacher, "Development of on-wafer microstrip characterization techniques," in 47th IEEE ARFTG Conference Digest, San Francisco, CA, June 1996, pp. 85-94.

BOOK CHAPTER
    S. Manohar, A. Pham, J. Brown, R. Borges, and K. Linthicum, “Microwave GaN-based Power Transistors on Large-Scale Silicon Wafers,” in Compound Semiconductor Integrated Circuits, edited by Tho Vu, World Scientific, 2003 (Invited).
BOOK
    J. Laskar, M. Tentzeris, S. Chakraborty, and A. Pham, Advanced Mixed Signal Communication Systems, manuscript submitted to John Wiley & Sons, Inc. August 2007.
PATENT
    A. Pham, A. Knoesen, D. Roitman, and Z. Wei, “Microwave Electromagnetic Band Resonator Bio-sensors,” pending 2003.
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