Research Group Members

Our Advisor

Current Graduate Students

Alumni

Advisor

Professor Anh-Vu Pham CV

Faculty Advisor

Professor
University of California
Department of Electrical and Computer Engineering
3141 Kemper Hall
One Shields Ave.
Davis, CA 95616-5294

Phone: (530) 752-7472
Fax: (530) 752-8428

Current Graduate Students

Kunia Aihara

Kunia received his B.S. degree (High Honors) in Electrical Engineering from UC Davis in June 2003. He is currently pursuing the Ph.D degree in Electrical Engineering at UC Davis. His research interest includes the development of multi-chip module (MCM) millimeter wave surfacemount packages using Liquid Crystal Polymer (LCP) up to 40GHz.

Cheng Chen

Cheng graduated from UC Irvine with a B.S. in Electrical and Computer Engineering. He is pursuing a M.S. degree in Electrical Engineering department in UC Davis. Currently, he is working on RF circuit packaging.

Chi Law

Chi Law is a graduate of UC Berkeley in 2004, with a BS in Electrical Engineering and Computer Science. He is currently pursuing his Ph.D degree from UC Davis. His research interest is RFIC design with emphasize on low-noise VCO, and high linearity amplifier design.

Mark McGrath

Mark received his B.S. from U.C. Davis in 2001. He has been working at Agilent Technologies, Santa Rosa for the past two years as a Production Test engineer. His interests include RFIC Design, Microwave Networks, and Digital Comunications. He is currently working on GaAs power amplifier designs for WLAN applications.

Alexander Stameroff

Alex received a B.S. Degree in Electrical Engineering from UC Davis in 2007. His research interest is class F amplifiers and Baluns using left handed transmission lines. He is a first year student in the doctorate program in the same field.

Hai Ta

Yiren Wang

Yiren graduated from Southwest University, Nanjing China with a B.S. in Electrical Engineering. She is pursuing a Ph.D degree in Electrical Engineering Department from UC Davis. Currently, she is working on Liquid Crystalline Polymers (LCP) lamination.