Wireline/Wireless RF-Interconnect: The next wave of connectivity
Thursday, May 17, Kemper Hall 1065, 10:00am-11:00am
Speaker: Sai-Wang (Rocco) Tam
Marvell Semiconductor, Santa Clara, CA
Performance of future VLSI system is limited by its interconnect bandwidth, power, performance and other fundamental physical limitations (such as mechanical reliability, thermal constraints, overall system form factor, etc.). Especially the interconnects in VLSI system, it has been predicted to be the ultimate limitation of the overall system performance in consumer electronics, high speed connector, high speed memory interface and future network-on-chip. Therefore, the interconnect system in future VLSI requires to have ultra-high data rates, scalable, re-configurable, highly compact and reliable interconnect fabric. In order to adopt such rapid evolution in future interconnect in both on-chip and chip-to-chip communication, I would like to explore the use of multiband RF/Wireless-Interconnects which can communicate simultaneously through multiple frequency bands with low power signal transmission, reconfigurable bandwidth and excellent mechanical flexibility and reliability. My future research will focus on RF/Wireless-Interconnect in four different potential application domains, which include Network-on-Chips (NoCs), advanced memory interface, ultra-high speed contactless connectors and ultra-low power wireless-interconnect technology.
Dr. Sai-Wang (Rocco) Tam was born in Hong Kong. He received the B.Sc., M.Sc., and Ph.D. degrees in electrical engineering from the University of California at Los Angeles in 2003, 2008, and 2009, respectively. From 2008 to 2010, he was the founding member of an early stage mm-wave semi-conductor company, WaveConnex Inc, Los Angeles, CA. In this position, he successfully demonstrated and developed the first ultra-short-distance mm-wave (60GHz) wireless system.
Currently, he is a Senior RFIC Design Engineer at Marvell Semiconductor Inc., Santa Clara, CA. His current research interests include high-speed mixed-signal circuits, mm-wave circuits, RF/Wireless-interconnect and network-on-chip. He has been published 18 conference and journal papers and one book chapter.
Dr. Tam’s recent paper “CMP Network-on-chip Overlaid with Multiband RF-Interconnect” was selected for the Best Paper Award at the 2008 IEEE International Symposium on High- Performance Computer Architecture (HPCA).