Current Status of Coherent Large-Scale InP Photonic Integrated Circuits

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Friday, October 14, Storer Hall 1322, 12:10pm-1:00pm

Speaker: Fred A. Kish
Vice President, PIC Development and Manufacturing
Infinera Corporation

Host: Professor Anh-Vu Pham

Abstract:

The current state-of-the-art for large-scale InP photonic integrated circuits (PICs) is reviewed with a focus on the devices and technologies that are driving the commercial scaling of these highly integrated devices. Specifically, high-capacity dense wavelength division multiplexed (DWDM) transmitter and receiver photonic integrated circuits (PICs) are reviewed with a focus next generation devices: >500 Gb/s and 1 Tb/s coherent multi-channel transmitter and receiver InP PICs. These large-scale PICs integrate hundreds of devices onto a single monolithic InP chip and enable significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption which4enable benefits at the component and system level.

Biography:

Dr. Fred A. KishFred A. Kish received his B.S., M.S., and Ph.D. degrees in electrical engineering from the University of Illinois at Urbana-Champaign in 1988, 1989, and 1992, respectively. His Ph.D. was obtained under the direction of Professor Nick Holonyak, Jr. on "Native Oxides on Aluminum-Bearing III-V Semiconductors with Applications to High-Performance Laser Diodes". This work is part of the core Al-bearing III-V native-oxide technology that has enabled the development of the highest performance vertical cavity surface emitting lasers (VCSELs) and has been licensed to VCSEL manufacturers throughout the world. From 1992 to 1999, he was at Hewlett-Packardís Optoelectronics Division where he co-invented and led the commercialization of the highest performance (efficiency) red-orange-yellow visible LEDs produced at the time (wafer-bonded transparent-substrate AlGaInP LEDs). The efficiencies of these devices exceeded those of incandescent and halogen lamps. Light-emitting diodes products based on this technology have resulted in over $1B in revenue to date.† From 1999 to 2001, he was with Agilent Technologies as the department manager of the III-V R&D and Manufacturing Department in the Network Solution Division. There, he led the department that developed commercially viable 2.5 Gb/s VCSELs and VCSEL/detector arrays (12 x 2.5 Gb/s) for next generation fiber-optic transceiver and the first parallel-optic transmitter/receiver products.

In 2001, he joined Infinera Corporation as Vice President of Photonic Integrated Circuit (PIC) Development and Manufacturing Department, and later, as Sr. Vice President of the Optical Integrated Components Group and Member of the Office of the COO. At Infinera, he co-invented and led the effort to research, develop, and commercialize the first practical (commercially deployed) large-scale PICs. These devices integrate over 50 discrete functions onto a single monolithic InP chip and represent over an order of magnitude advance in integration complexity than previous devices. The large-scale PICs are the core technology that has enabled new network architectures for DWDM transport systems. Networks utilizing these large-scale photonic integrated circuits have been deployed in the field and have been running live traffic since 2004. These large-scale photonic integrated circuits were the first InP-based commercially deployed devices to: operate at 100Gb/s, to integrate multiple DWDM channels on a PIC, to utilize arrayed-waveguide gratings (AWGs), and to utilize arrays of tunable lasers. More recently, the Photonic Integrated Circuit Group at Infinera has developed 500 Gb/s transmitter and receiver PICs integrating over 400 functions onto a single monolithic chip. The large-scale PICs are at the core of Infineraís optical network products that have achieved #1 market share in North America and #2 market share worldwide in the long-haul DWDM optical communications market and have been the enabling technology behind over $1.5B in PIC-based networking product sales.

Dr. Kish is a Fellow of the Optical Society of America (OSA) and Institute of Electrical and Electronics Engineers (IEEE). His awards include the IEEE David Sarnoff Award, the IEEE LEOS Engineering Achievement Award, the OSA Adolph Lomb Award, the International Symposium on Compound Semiconductors Young Scientist Award, and the Distinguished Alumni Award, Young Alumni Achievement Award, R.T. Chien Award, and the E.C. Jordan Award from the University of Illinois ECE Department. He has co-authored over 100 U.S. Patents and over 60 peer-reviewed publications.