EEC233 – High Speed Signal Integrity
3 units – Spring Quarter
Lecture: 3 hours
Prerequisite: EEC 130B
Design and analysis of interconnects in high-speed circuits and sub-systems; understanding of high-speed signal propagation and signal integrity concepts; electromagnetic modeling tools and experimental techniques.
Expanded Course Description:
- Overview of Interconnect Design and Digital Systems Engineering
- Analysis of Interconnects
- Electrical Models of Interconnects
- Non-ideal Interconnect Issues
- Connectors, Packages, and Vias
- Frequency- and Time-Domain Measurements and Modeling Tools
- Definition of Mixed-Mode S-parameters
- Multiport Mixed-Mode S-parameter Measurements
- Time-Domain Reflectometry
- Electromagnetic Simulators
- Noise in Digital Systems
- Power Supply Noise
- Crosstalk (NEXT and FEXT)
- Intersymbol Interference
- Timing, Skew, and Jitter
- Electromagnetic Interference (EMI)
- Physical Mechanisms of Radiation
- EMI Suppression Techniques
- Howard Johnson & Martin Graham, High-Speed Signal Propagation Advanced Black Magic, Englewood Cliffs: Prentice-Hall, 2003.
- William J. Dally & John W. Poulton, Digital Systems Engineering, Cambridge University Press, 2000.
- Stephen H. Hall, Garrett W. Hall, and James A. McCall, high-Speed Digital System Design, John Wiley & Sons, 2000.
- Henry W. Ott, Noise Reduction Techniques in Electronic Systems, John Wiley & Sons, 1988.
EEC233 is involved with high speed signals propagating in multi-port systems. Potential overlaps include the analysis of multi-port planar circuits (EEC232) or some aspects of noise (EEC211).
Last revised: July 2009