ECE Header Logo

EEC233 – High Speed Signal Integrity

3 units – Spring Quarter

Lecture: 3 hours

Prerequisite: EEC 130B

Grading: Letter.

Catalog Description:

Design and analysis of interconnects in high-speed circuits and sub-systems; understanding of high-speed signal propagation and signal integrity concepts; electromagnetic modeling tools and experimental techniques.

Expanded Course Description:

  1. Overview of Interconnect Design and Digital Systems Engineering
  2. Analysis of Interconnects
    1. Electrical Models of Interconnects
    2. Non-ideal Interconnect Issues
    3. Connectors, Packages, and Vias
  3. Frequency- and Time-Domain Measurements and Modeling Tools
    1. Definition of Mixed-Mode S-parameters
    2. Multiport Mixed-Mode S-parameter Measurements
    3. Time-Domain Reflectometry
    4. Electromagnetic Simulators
  4. Noise in Digital Systems
    1. Power Supply Noise
    2. Crosstalk (NEXT and FEXT)
    3. Intersymbol Interference
    4. Timing, Skew, and Jitter
  5. Electromagnetic Interference (EMI)
    1. Physical Mechanisms of Radiation
    2. EMI Suppression Techniques

Textbook/reading:

  1. Howard Johnson & Martin Graham, High-Speed Signal Propagation Advanced Black Magic, Englewood Cliffs: Prentice-Hall, 2003.
  2. William J. Dally & John W. Poulton, Digital Systems Engineering, Cambridge University Press, 2000.
  3. Stephen H. Hall, Garrett W. Hall, and James A. McCall, high-Speed Digital System Design, John Wiley & Sons, 2000.
  4. Henry W. Ott, Noise Reduction Techniques in Electronic Systems, John Wiley & Sons, 1988.

Course Overlap:
EEC233 is involved with high speed signals propagating in multi-port systems. Potential overlaps include the analysis of multi-port planar circuits (EEC232) or some aspects of noise (EEC211).

Last revised: July 2009